Asm America, Inc.

Asm IP Holding B.v.

Ravinder K Aggarwal

Ivo Johannes Raaijmakers

Robert C Haro

Bob Haro

Jeroen Stoutjesdijk

Paul T Jacobson

Tony J Keeton

Mark R Hawkins

Matthew G Goodman

Ronald R Stevens

Mike Halpin

James F Kusbel

Loren R Jacobs

Eric R Hill

John DiSanto

Armand Ferro

Gregory M Bartlett

Rand Conner

Jim Kusbel

Robert Michael Vyne

Paul D Brabant

James S Roundy

Joseph P Italiano

Matt G Goodman

Buz Darabnia

Andy Yednak

Paul R Carr

Jereon Stoutyesdijk

Lee Haen

Loring G Davis

Jerry Davis

Eric James Shero

Michael Eugene Givens

Michael W Halpin

Dennis L Goodwin

David R Rodriguez

Mark A Kleshock

James A Alexander

Jim Alexander

Allan Doley

Kenneth O'Neill

Gerben Vrijburg

Rod Lenz

Nilesh Rajbharti

Jeroen Stoutyesdijk

Matt Goodman

Bobby Vyne

A self-centering susceptor ring assembly is provided. The susceptor ring assembly includes a susceptor ring support member and a susceptor ring supported on the susceptor ring support member. The susceptor ring support member includes at least three pins extending upwardly relative to the lower inner surface of the reaction chamber. The susceptor ring includes at least three detents formed in a bottom surface to receive the pins from the susceptor ring support member. The detents are configured to allow the pins to slide therewithin while the susceptor ring thermally expands and contracts, wherein the detents are sized and shaped such that as the susceptor ring thermally expands and contracts the gap between the susceptor ring and the susceptor located within the aperture of the susceptor ring remains substantially uniform about the entire circumference of the susceptor, and thereby maintains the same center axis.

Self-centering susceptor ring assembly

A reaction apparatus for a semiconductor fabrication apparatus, wherein the reaction apparatus includes at least two adjustable outlet ports for withdrawing reactant gases from the reaction chamber. Adjustment of the flow rate through each of the outlet ports selectively modifies the flow pattern of the reactant gases within the reaction chamber to maintain a desired flow pattern therewithin, such as a substantially uniform flow over the surface of a substrate being processed, and/or minimization of turbulence within the reactor.

Reaction apparatus having multiple adjustable exhaust ports

A temperature measuring device having a smart chip, or electronic circuit, integrated therein is provided. The smart chip, or electronic circuit, includes at least a unique identification number or data specific to the particular temperature measuring device stored thereon. The electronic circuit further includes calibration data of the temperature measuring device stored thereon. A module controller of a temperature control system is configured to verify the unique identification number of the thermocouple assembly prior to allowing data to be transferred between the temperature measuring device and a temperature controller. A graphical user interface allows an operator to enter the unique identification number or data to verify the temperature measuring device and display an error message if the number or data entered is not equivalent, or does not match, the unique identification number or data stored on the electronic circuit.

Smart temperature measuring device

An improved thermocouple assembly for providing a temperature measurement is provided. The thermocouple assembly includes a sheath having a measuring tip, a support member received within the sheath, and first and second wires disposed within the support member. An end of each of the first and second wires are fused together to form a thermocouple junction therebetween. A recessed region is formed in a distal end of the support member, and the thermocouple junction is fixedly located at the base of the recessed region such that the recessed region maintains the thermocouple junction in a substantially fixed position relative to the measuring tip of the sheath.

Thermocouple assembly with guarded thermocouple junction

A load lock includes a chamber including an upper portion, a lower portion, and a partition between the upper portion and the lower portion, the partition including an opening therethrough. The load lock further includes a first port in communication with the upper portion of the chamber and a second port in communication with the lower portion of the chamber. The load lock includes a rack disposed within the chamber and a workpiece holder mounted on a first surface of the rack, wherein the rack and the workpiece holder are movable by an indexer that is capable of selectively moving wafer slots of the rack into communication with the second port. The indexer can also move the rack into an uppermost position, at which the first surface of the boat and the partition sealingly separate the upper portion and the lower portion to define an upper chamber and a lower chamber. Auxiliary processing, such as wafer pre-cleaning, or metrology can be conducted in the upper portion.

Load lock having secondary isolation chamber

A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.

Thermocouple

Methods and apparatuses for separately injecting gases into a reactor for a substrate processing system. The flow profiles of the gases are controlled with two or more sets of adjustable gas flow injectors. The methods are particularly useful for selective deposition of gases in a CVD system using volatile combinations of precursors and etchants. In either case, the gases are provided along separate flow paths that intersect in a relatively open reaction space, rather than in more confined upstream locations.

Substrate reactor with adjustable injectors for mixing gases within reaction chamber

A one-piece susceptor ring for housing at least one temperature measuring device is provided. The susceptor ring includes a plate having an aperture formed therethrough and a pair of side ribs integrally connected to a lower surface of the plate. The side ribs are located on opposing sides of the aperture. The susceptor ring further includes a bore formed in each of the pair of side ribs. Each bore is configured to receive a temperature measuring device therein.

Susceptor ring

A thermocouple having at least one inner alignment feature or at least one outer alignment feature, or a combination thereof for positively positioning and aligning at least one thermocouple junction within a bore formed in a susceptor ring of a semiconductor substrate processing reactor. The outer alignment feature is configured to positively align the junction(s) longitudinally within the bore. The inner alignment feature configured to positively position the junction(s) rotationally within the sheath of the thermocouple relative to the bore.

A substrate support system comprises a substrate holder having a plurality of passages extending between top and bottom surfaces thereof. The substrate holder supports a peripheral portion of the substrate backside so that a thin gap is formed between the substrate and the substrate holder. A hollow support member provides support to an underside of, and is configured to convey gas upward into one or more of the passages of, the substrate holder. The upwardly conveyed gas flows into the gap between the substrate and the substrate holder. Depending upon the embodiment, the gas then flows either outward and upward around the substrate edge (to inhibit backside deposition of reactant gases above the substrate) or downward through passages of the substrate holder, if any, that do not lead back into the hollow support member (to inhibit autodoping by sweeping out-diffused dopant atoms away from the substrate backside).

Substrate support system for reduced autodoping and backside deposition

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Gilbert, AZ, United States of America

Ravinder K Aggarwal