Micron Technology Incorporated

Ravikumar Adimula

Myung Jin Yim

Jason M Brand

James Jian Zhang

Dejen Eshete

Dan Graves

Jacob Brooksby

Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, including a die and an encapsulant material formed over the die, and at least one topological feature formed on an external surface of the encapsulant material, and configured to resist out-of-plane deformation of the package. Other embodiments may be described and claimed.

Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation

A multi-die building block for a stacked-die package is described. The multi-die building block includes a flex tape having a first surface and a second surface, each surface including a plurality of electrical traces. A first die is coupled, through a first plurality of interconnects, to the plurality of electrical traces of the first surface of the flex tape. A second die is coupled, through a second plurality of interconnects, to the plurality of electrical traces of the second surface of the flex tape.

Multi-die building block for stacked-die package

Growing community of inventors

Chandler, AZ, United States of America

Ravikumar Adimula