3M Innovative Properties Company

Ravi Palaniswamy

Andrew John Ouderkirk

Arokiaraj Jesudoss

Justine A Mooney

Siang Sin Foo

Alejandro Aldrin Il Agcaoili Narag

Alejandro Aldrin A Narag, Ii

Jian Gao

Fong Liang Tan

Nathan P Kreutter

Alejandro Aldrin Ii Agcaoili Narag

Nicholas T Gabriel

Hiromitsu Kosugi

Antonny Enojo Flor

Ronald David Jesme

Andrew P Bonifas

Robert M Jennings

Robin E Gorrell

Qihong Nie

Dominic M Travasso

James R White

Douglas B Gundel

Moses Mekala David

Michael Alan Meis

Zhisheng Yun

Dong-Soo Lee

Roger W Barton

Ankit Mahajan

John D Geissinger

James F Poch

Milind Balwant Sabade

Muthu Sebastian

Xiaohui Cheng

Mahmut Aksit

Michael W Dolezal

Yarn Chee Poon

Brinda B Badri

Gareth A Hughes

Brent D Lunceford

Kelly Reed Ingham

Jae Yong Lee

Sung Won Moon

Kihoon Sung

Woo-Young Ahn

Phillip J Bergeron

Alejandro Aldrin Agcaoili Narag, Ii

Sheldon B Ruiz

Bee Leng Tan

Donato G Caraig

Alejandro Aldrin Il A Narag

Augusto A Noronha, Iii

Wei Meng Pee

Justina Sze Ying Lee

Sheldon Baylosis Ruiz

Antonny Flor

Alejandro Aldrin A Narag Ii

Antonny E Flor

A direct to chip cooling film for two-phase cooling. The film includes a dielectric layer having a first surface for attachment to a cold plate or circuits and having a second surface. A metal layer is on the second surface of the dielectric layer with a pattern of features on a side opposite the dielectric layer. This surface pattern provides increased surface area and multiple nucleation sites for bubbles formation for two-phase cooling. The features can also include metal nodules to further enhance the nucleation.

Patterned design for thermal management of two-phase immersion cooling system for electronics

The present disclosure relates to a method of fabricating a thermoelectric device. The method includes disposing a metal layer on a dielectric layer to form a sub-assembly, forming patterned circuits on the metal layer, forming blind vias in the dielectric layer, fabricating first thermoelectric elements in a first series of blind vias, and fabricating second thermoelectric elements in a second series of blind vias to form thermoelectric units with the first thermoelectric elements and the patterned circuits. The sub-assembly is configured to be joined to an adjacent sub-assembly along a first direction, and the first and second thermoelectric elements of each thermoelectric unit are aligned in a second direction substantially perpendicular to the first direction. The present disclosure further relates to a thermoelectric device which includes a plurality of thermoelectric units forming a strip extending in a first direction.

Flexible thermoelectric device

Systems and methods for monitoring the status of air filters are provided. One or more thermoelectric sensors are provided to have an upstream sensing surface positioned adjacent the inlet surface of the air filter, and a downstream sensing surface positioned adjacent the outlet surface of the air filter. Sensing circuitry are connected to the thermoelectric sensors, configured to receive signals from the thermoelectric sensors and process the signals to obtain status information of the air filter.

Air filtration monitoring based on thermoelectric devices

Electrical conductors are disclosed. More particularly, undulating electrical conductors are disclosed. Certain disclosed electrical conductors may be suitable to be disposed on flexible or stretchable substrates.

Electrical conductors

A flexible multilayer construction () for mounting a plurality of light emitting semiconductor devices (LESDs) includes a flexible dielectric substrate () comprising top () and bottom () major surfaces, and pluralities of corresponding electrically conductive top () and bottom () pads disposed on the top and bottom major surfaces, respectively. An electrically conductive via () connects each pair of corresponding top and bottom pads, a side of each top pad partially overlapping a side of the corresponding bottom pad and a side of the substrate, such that in a plan view, each top pad fully overlaps the corresponding bottom pad.

Multilayer LED substrate

A flexible polymeric dielectric layer () having first and second major surfaces, the first major surface having a conductive layer () thereon, the dielectric layer having at least one conduit () extending from the second major surface to the first major surface, the conduit having at least one lateral dimension of at least about one centimeter and being at least partially filled with conductive material (), the conductive layer including at least one conductive feature () substantially aligned with the conduit (), the conductive feature () supporting a plurality of light emitting semiconductor devices ().

Flexible light emitting semiconductor device with large area conduit

A flexible dielectric substrate () defines a LESD mounting region () including two conductive filled vias () extending through the flexible dielectric substrate () and the LESD mounting region is substantially surrounded by two conductive frame portions (). The frame portions are in electrical connection with the conductive filled vias (), respectively. The conductive filled vias () form conductive features in the mounting region () that are co-planar with each other.

Flexible circuits for mounting light emitting semiconductor device

A flexible multilayer construction () for mounting a light emitting semiconductor device () (LESD), includes a flexible dielectric substrate () having an LESD mounting region (), first and second electrically conductive pads () disposed in the LESD mounting region for electrically connecting to corresponding first and second electrically conductive terminals of an LESD () received in the LESD mounting region, and a first fiducial alignment mark () for an accurate placement of an LESD in the LESD mounting region. The first fiducial alignment mark is disposed within the LESD mounting region.

Fiducial mark for chip bonding

Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

Flexible LED assembly with UV protection

A flexible film including one or more MEMS elements and articles including the flexible film are described. The flexible film includes a polymer layer between two metal layers with one of the metal layers containing a perforation. The polymer layer includes voided regions that allow for relative movement of the two metal layers.

MEMS devices on flexible substrate

A reflection sheet and a method of manufacturing a reflection sheet are disclosed. The reflection sheet comprises a substrate layer and a reflective layer formed on the substrate layer, wherein the reflective layer comprises an alloy consisting of silver (Ag), palladium (Pd) and neodymium (Nd).

Reflection sheet and method of manufacturing the same

Provided is a light emitting semiconductor device comprising a flexible dielectric layer, a conductive layer on at least one side of the dielectric layer, at least one cavity or via in the dielectric substrate, and a light emitting semiconductor supported by the cavity or via. Also provided is a support article comprising a flexible dielectric layer, a conductive layer on at least one side and at least one cavity or via in the dielectric substrate. Further provided is a flexible light emitting semiconductor device system comprising the above-described light emitting semiconductor device attached to the above-described support article.

Two part flexible light emitting semiconductor device

Flexible LED assemblies () are described. More particularly, flexible LED () assemblies having flexible substrates () with conductive features () positioned on or in the substrate, and layers of ceramic () positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

Flexible LED assemblies that have coplanar integrated conductive features upon which an LED can be mounted, and methods of making such LED assemblies are described. The flexible LED assembly includes a flexible polymer substrate, a first conductive feature, a second conductive feature and an LED. The first conductive feature is positioned both within the flexible substrate and on a surface of the flexible substrate. The second conductive feature is positioned both within the flexible substrate and on a surface of the flexible substrate. The first and second conductive features are separated by a gap therebetween. The LED is mounted on both the first and second conductive features, and the first and second conductive features are substantially coplanar with one another.

Flexible circuits with coplanar conductive features and methods of making same

Growing community of inventors

Singapore, Singapore

Ravi Palaniswamy