Amkor Technology, Inc.

Ravi Kiran Chilukuri

Ronald Patrick Huemoeller

Rex Anderson

Robert Lanzone

Sundeep Nand Nangalia

Richard Raymond Green

Rex Beach Anderson, Iii

An electronic component package includes a RDL pattern comprising a redistribution pattern terminal. A buildup dielectric layer is formed on the RDL pattern, the buildup dielectric layer having a redistribution pattern terminal aperture exposing the redistribution pattern terminal. An interconnection ball is formed within the redistribution pattern terminal aperture and on the redistribution pattern terminal. The interconnection ball includes an enclosed portion having an outer concave surface within the buildup dielectric layer. The angle of intersection between the outer concave surface of the interconnection ball and the redistribution pattern is less than 90&#xb0;. This minimizes stress between the interconnection ball and the redistribution pattern which, in turn, minimizes failure of the bond between the interconnection ball and the redistribution pattern.

Electronic component package fabrication method and structure

A method of fabricating a bumped chip package includes forming a first seed layer on a dielectric layer, the dielectric layer comprising a dielectric layer opening exposing a substrate terminal of a substrate, the first seed layer being formed within the dielectric layer opening and on the substrate terminal. A circuit pattern is plated on the first seed layer, wherein an exposed portion of the first seed layer is exposed from the circuit pattern. The exposed portion of the first seed layer is removed by laser-ablation. By using a laser-ablation process, a chemical etching process is avoided thus eliminating the need to treat or dispose of chemical etching hazardous waste. Further, circuit pattern width erosion and undercut of the circuit pattern associated with a chemical etching process are avoided.

Bumped chip package

Bumped chip package fabrication method and structure

Growing community of inventors

Cary, NC, United States of America

Ravi Kiran Chilukuri