Qualcomm Incorporated

Qualcomm Innovation Center, Inc.

Ravi Alamanda

Alexy Joseph

Anssi Haverinen

Ayan Ghosh

Harikishan Desineni

Srinivas Krovvidi

Siddartha Shaik

Aniketkumar Lata

Sridhar Nomula

SathishKumar Mani

Vivek Mehta

A Bluetooth component (e.g., a Bluetooth chip) and a digital signal processing (DSP) component (e.g., an audio DSP) of a device may directly handle link condition sensing (e.g., link quality monitoring) and audio bitrate determination. The Bluetooth component may perform link condition sensing (e.g., link quality monitoring) and the Bluetooth component and/or the DSP component may perform link condition processing and audio bitrate determination. Encoding scheme (e.g., audio bitrate) determination and modification may be performed independently by the Bluetooth component and DSP component, such that encoding schemes may be adapted to link conditions while other hardware (e.g., connected to the DSP) is operating in a low power or sleep state. In some cases, the Bluetooth component may sense link conditions and transmit bitrate information directly to audio encoding blocks of the DSP component.

Power optimized link quality detection and feedback

Provided are a method and device for audio post-processing. The method may comprise receiving, at a first processor, an audio signal, detecting, at the first processor, a plurality of post-processing modules for altering the audio signal, and creating, based on information identifying functions of the plurality of post-processing modules, an optimized acceleration module. It may further comprise sending, through the optimized acceleration module, a buffer packet of the audio signal along a single data path to a second processor and post-processing, at the second processor, the buffer packet of the audio signal through each of a plurality of associated post-processing modules that correspond to the post-processing modules on the first processor, controlling each associated post-processing module via control paths from each corresponding post-processing module, and receiving, at the first processor, a post-processed buffer packet of the audio signal via a single return data path.

Efficient load sharing and accelerating of audio post-processing

Growing community of inventors

San Diego, CA, United States of America

Ravi Alamanda