Juniper Networks, Inc.

Raveen Jagadeesan

Senthil Kumar Ramaswamy Venkat

Mruthyunjaya S

Suresh Anandan

Anuya Reddy

Girish Muddenahalli Haleshappa

Mokshith Tejasvi

Saravanan Govindasamy

A disclosed clamp for securing male and female connectors together may include a spine, at least one arm that extends from a side of the spine, and at least one additional arm that extends from an additional side of the spine. In this example, the arm and the additional arm may be configured to collectively secure the spine against a cable-side connector coupled to a board-side connector to prevent the cable-side connector from decoupling from the board-side connector. Various other apparatuses, systems, and methods are also disclosed.

Apparatus, system, and method for securing male and female connectors together without positive locks

A field-replaceable unit (FRU) includes an ejector component that is to facilitate removal of the FRU from a network system chassis, a knob that is connected to the ejector component, and a knob adjustment prevention apparatus. The knob adjustment prevention apparatus includes a mounting component and a guard component. The mounting component is attached to a frame of the FRU. The guard component is connected to the mounting component and is to move between a closed position and one or more open positions. The guard component, when positioned in the closed position, surrounds the knob to prevent physical adjustment of the knob. This prevents activation of the ejector component, and thereby prevents removal of the FRU from the network system chassis, such as when the FRU is operating.

Apparatus to prevent physical adjustment of a knob of a field-replaceable unit (FRU)

A fan tray, for a fan module of a network device chassis, may include an inner assembly that includes an inner cassette, one or more fans connected to the inner cassette, a first latch connected to the inner cassette and configured to removably connect to an outer assembly of the fan tray, and a fan controller connected to the inner cassette and configured to control operation of the one or more fans. The outer assembly may be configured to receive and retain the inner assembly, and may include an outer cassette with one or more openings configured to communicate with the one or more fans, a second latch connected to the outer cassette and configured to removably connect to a rear portion of the network device chassis, and an adaptor connected to the outer cassette and configured to connect and provide power to the fan controller.

Pivotable removable fan module for a rackmount network device chassis

A semiconductor package may include a substrate, an application-specific integrated circuit (ASIC) provided on a first portion of a surface of the substrate, a memory device provided on a second portion of the surface of the substrate, and a stiffener plate provided on a third portion of the surface of the substrate. The stiffener plate may be spaced from and may surround the ASIC and the memory device. The semiconductor package may include an electromagnetic interference (EMI) absorber provided on a fourth portion of the surface of the substrate. The EMI absorber may be provided between the stiffener plate and the ASIC and the memory device. The EMI absorber may surround the ASIC and the memory device and may block EMI radiation generated by the ASCI and the memory device.

Containing electromagnetic interference radiation in lidless semiconductor packages

The disclosed apparatus may include (1) a cage that houses at least one field-replaceable electronic module that, when operational, emits heat within a computing device, wherein the cage comprises (A) a front entry side that facilitates installation of the field-replaceable electronic module and (B) a back side that is located opposite the front entry side, (2) a heatsink that removably interfaces with the field-replaceable electronic module when the field-replaceable electronic module is installed in the cage and (3) a spring mechanism that (A) is coupled to the back side of the cage and (B) applies force to the heatsink such that the heatsink (I) is pressed against the field-replaceable electronic module and (II) establishes thermal contact with the field-replaceable electronic module to facilitate heat transfer from the field-replaceable electronic module to the heatsink. Various other apparatuses, systems and methods are also disclosed.

Apparatus, system, and method for improved thermal contact between heatsinks and field-replaceable electronic modules

The disclosed apparatus may include (1) a cage that houses at least one field-replaceable electronic module that, when operational, emits heat within a computing device, wherein the cage comprises (A) a front entry side that facilitates installation of the field-replaceable electronic module and (B) a back side that is located opposite the front entry side, (2) a heatsink that removably interfaces with the field-replaceable electronic module when the field-replaceable electronic module is installed in the cage, and (3) a spring plate that (A) is coupled to the heatsink and (B) applies force to the heatsink such that the heatsink (I) is pressed against the field-replaceable electronic module and (II) establishes thermal contact with the field-replaceable electronic module to facilitate heat transfer from the field-replaceable electronic module to the heatsink. Various other apparatuses, systems, and methods are also disclosed.

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Bengaluru, India

Raveen Jagadeesan