Gopro, Inc.

Raul Vargas Gonzalez

Nicholas R Vitale

Herman Wong

An image capture device having a housing and a heatsink. The image capture device includes an integrated sensor and lens assembly. The heatsink is located partially or completely within the housing. The heatsink includes a through which a portion of the integrated sensor and lens assembly extends, and a planar surface located adjacent to the cutout. The planar surface includes a front side and a rear side. A printed circuit board in communication with a rear side of the planar surface of the heatsink. An LCD recess located in a front side of the planar surface of the heatsink that is configured to receive a liquid crystal display, wherein the LCD recess is opposite the printed circuit board.

Heatsink of an image capture device

A image capture device including: heat generating devices, one or more batteries, and a sensor heat spreader. The heat generating devices generate a thermal load. The sensor heat spreader is in thermal communication with one or more of the heat generating devices and extends from the one or more of the heat generating devices to the one or more batteries so that all or a portion of the thermal load is transferred to the one or more batteries.

Heatsinks and thermal architecture of an image capture device

An image capture device that includes a housing and a heatsink located partially or completely within the housing. The heatsink comprises a planar surface, a printed circuit board in communication with the heatsink, and a sheet conductor that is a graphite sheet connected to the planar surface of the heatsink and in direct contact with the printed circuit board or components of the printed circuit board.

Growing community of inventors

Redwood City, CA, United States of America

Raul Vargas Gonzalez