Motorola Corporation

Raul Olivera

Christopher N Kurby

Lawrence F Cygan

David Hanson

Terry K Mansfield

Robert Thomas Hirsbrunner

Gary R Reynolds

Gary E Peterson

Ross E Ruthenberg

John N Lubbe

Richard H Burzynski

Janice M Weber

Hans L Schoemer

Lester J Onyszko

John F Pottle

Thomas R Gaynor

Jay G Smith

Face plate for a receiver

Front panel for a modular radio assembly

A first heat sink member with extension slots and component detailing is cast from a thermally conductive material. Fin members are constructed from a similar, but not necessarily identical, thermally conductive material. The fin members are constructed so that they will mate with the extension slots of the first heat sink member. Positioned in alignment with the extension slots to the first heat sink member, the fin members are attached with a thermally conductive bonding agent.

Method and apparatus of an improved heat sink

Cardcage chassis for electronic equipment or similar article

An improved fuse and mounting arrangement is disclosed especially suited for mounting on a printed circuit board or the like. The fuse device itself is of the two-bladed type for reinserting in an individual fuse holder. The holder is formed of a thermo setting plastic with a high resistance to heat. End positioned cavities in the holder are dimensioned to receive conductive terminals which accommodate the fuse blades and which holder further includes leg portions extending downwardly for appropriate attachment to the associated printed circuit board, such as by soldering or the like.

Fuse and mounting arrangement for printed circuit board application

The invention is a grounding/positioning clip for providing a DC ground return path, low inductance AC ground path between circuit boards and for positioning electronic components in relation to an electronic device. The assembly includes a heat spreader with an electronic device mounted thereon. The leads of the electronic device are physically and electrically attached to first and second circuit boards. A clip, which has electronic components mounted thereon, fits over the electronic device thereby positioning the electronic components in correct physical relationship to the electronic device and the first and second circuit boards. Also the clip acts as a low inductance AC ground path between the first and second circuit boards and also provides a DC ground path. Preferrably the electronic device is a power transistor and the electronic components mounted on the clip are miniature compression mica capacitors for RF matching. The clip is preferrably formed of sheet metal with a good conductor such as copper plated on the surface.

Grounding and positioning clip for a power transistor

The invention is a microphonics suppression means for a high frequency resonant cavity. The resonant cavity is used in a RF oscillator to generate UHF/VHF frequencies. The resonant cavity comprises an outer wall portion, a center conductor portion, a tuning slug and a plurality of coupling probes. The coupling probes, tuning slug and center conductor are held in a fixed relationship by a microphonics suppression means made of a low dielectric material which fits over and around the center conductor and encapsulates the coupling probes and collars the tuning slug. The microphonics suppression means reduces the effect of microphonics on the output signal of the RF oscillator, thus allowing a clean output signal suitable for high power applications.

Resonant cavity with integrated microphonic suppression means

Growing community of inventors

Hoffman Estates, IL, United States of America

Raul Olivera