Psemi Corporation

Peregrine Semiconductor Corporation

Metawave Corporation

Hollinworth Fund, L.l.c.

Rayspan Corporation

Raul Inocencio Alidio

Peter Bacon

Maha Achour

Jianhua Lu

Vikram Sekar

Ajay Chandra Gummalla

Alexandre Dupuy

Cheng-Jung Lee

Woo Yong Lee

Can Zheng

Ravindranath D Shrivastava

Chiara Pelletti

Taha Shahvirdi Dizaj Yekan

Soren Shams

Ricky Donald Heckler

In the present invention a guide or carrier is used to assemble and position multiple AiPs (or Integrated Circuit packages) on a substrate and maintain spacing therebetween. In some examples, this reduces package size and maintains desired tolerances. The carrier or guard is to be thin and flexible so as to allow some movement but maintain tolerances at specific locations.

Assembly in place method and apparatus

Examples disclosed herein relate to a high frequency component isolation for wireless and radar systems. The disclosure herein includes a radar system that has an array of radiating elements and a phase control module coupled to the array of radiating elements. The phase control module is configured to isolate one or more transmission signal paths through the phase control module from at least one conductor electrically coupled to one or more active circuits in the phase control module, the at least one conductor proximate to the one or more transmission signal paths. The phase control module is configured to adjust a reactance in a transmission signal propagating through the isolated one or more transmission signal paths to one or more radiating elements of the array of radiating elements. Other examples disclosed herein include beamforming system with high frequency component isolation and a method of beamforming with high frequency component isolation.

High frequency component isolation for wireless and radar systems

Examples disclosed herein relate to a Meta-Structure ('MTS') antenna system with adaptive frequency-based power compensation. The MTS antenna system includes a radiating array structure having a plurality of radiating elements, and a transmission array structure coupled to the radiating array structure and feeding a transmission signal through to the radiating array structure. The transmission array structure has a plurality of super element transmission paths, each having a plurality of vias to form transmission paths and a plurality of slots for feeding the transmission signal to the radiating array structure, and a plurality of power amplifiers coupled to an adaptive feedback module, each power amplifier coupled to a super element transmission path, the adaptive feedback module to adjust a power gain at a center frequency.

Meta-structure antenna system with adaptive frequency-based power compensation

An RF switching device having distributed shunt switches distributed along transmission lines to improve RF bandwidth as well as the signal isolation of the device. The shunt switches may be physically positioned on both sides of the transmission lines to keep an integrated circuit (IC) design essentially symmetrical so as to provide predictable and reliable operational characteristics. Some embodiments include stacked FET shunt switches and series switches to tolerate high voltages. In some embodiments, the gate resistor for each FET shunt switch is divided into two or more portions.

Radio frequency switching circuit and distributed switches

A method and apparatus for adjusting the slope of insertion loss of digital step attenuator (DSA). The DSA is implemented on an integrated circuit. The DSA has two series inductances that are introduced between the input of DSA cell and a resistor in the cell, and the output of DSA cell and another resistor in the cell. In one embodiment, adjustment in the value of the series inductances is as achieved by altering the locations of the input port and the output ports. In another embodiment, adjustment in the value of the inductances is achieved by tailoring the length and width of the conductor trace used to connect the input and output ports to the series resistors. The adjustment in the values of the inductances provides a means by which the roll-off of the insertion loss as a function of frequency in the attenuation state can be controlled.

Method and apparatus for adjusting the slope of insertion loss as a function of frequency of RF digital step attenuators

Radio frequency switching circuit with distributed switches

Systems, methods, and apparatus for reducing standing wave reflections between delay line modules are described. The delay line modules include semiconductor switches, particularly MOSFET switches fabricated on silicon-on-insulator ('SOI') and silicon-on-sapphire ('SOS') substrates and embedded attenuators. According to one aspect, a delay line module includes two switches with delay lines coupled between respective output ports of the switches. Each switch includes MOSFET switches forming conduction paths with selectable high and low impedances. According to another aspect, at least one of the conduction paths includes an attenuator block formed by one or more shunting resistors coupled to one of the MOSFET switches. The output ports of the switches can be selectively coupled to a reference ground via a shunted MOSFET switch.

Delay line system and switching apparatus with embedded attenuators

A monolithically integrated switch configured to operate at an input signal frequency ranging from 0 Hz to 80 GHz. The switch has an input port and two output ports. A first conduction path is provided from the input port to the first output port. A second conduction path is provided from the input port to the second output port. In addition, a first shunting path is provided between the first output port and a reference and a second shunting path is provided between the second output and the reference. In a first mode, the first conduction path and the second shunting path have a low impedance. The second conduction path and the first shunting path have a high impedance. In a second mode, the first conduction path and the second shunting path have a high impedance. The second conduction path and the first shunting path have a low impedance.

Designs and techniques associated with power amplifiers for amplifying RF signals to provide variable power amplification and improved linearity in various RF amplification circuits, including power amplifiers operated under the power back-off conditions.

RF power amplifiers with linearization

Implementations and examples of power amplifier devices, systems and techniques for amplifying RF signals, including power amplifier systems based on Composite Right and Left Handed (CRLH) metamaterial (MTM) structures.

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Carlsbad, CA, United States of America

Raul Inocencio Alidio