Applied Materials, Inc.

Rashid Mavleiv

Shijian Li

Alexander N Lerner

Jianshe Tang

Boris Fishkin

Michael N Sugarman

Haoquan Fang

Younes Achkire

Boris T Govzman

Guy Shirazi

In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluidnozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

Single wafer dryer and drying methods

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Campell, CA, United States of America

Rashid Mavleiv