Intel Corporation

Cavendish Kinetics Limited

Rashed Mahameed

David I Poisner

Tanay Karnik

Mohamed A Abdelmoneum

Kristen L Dorsey

Richard Lee Knipe

Paul J Gwin

Mark E Sprenger

Robertus Petrus Van Kampen

Hao-Han Hsu

Dong-Ho Han

Roberto Gaddi

Anartz Unamuno

Mondira D Pant

Mamdouh O Abdelmejeed

Mamdouh O M M Abdelmejeed

Stephen Pisenti

The present invention generally relates to a MEMS device having a plurality of cantilevers that are coupled together in an anchor region and/or by legs that are coupled in a center area of the cantilever. The legs ensure that each cantilever can move/release from above the RF electrode at the same voltage. The anchor region coupling matches the mechanical stiffness in all sections of the cantilever so that all of the cantilevers move together.

Merged legs and semi-flexible anchoring having cantilevers for MEMS device

Methods and systems may provide for detecting a location of an adjacent ultrasonic receiver of a battery powered device relative to a charging surface of a contactless charger. The charging surface may include an ultrasonic array of transmitter sub arrays, wherein one or more of the transmitter sub arrays may be selectively activated based on the location to focus an ultrasonic beam on the adjacent ultrasonic receiver. In one example, a movement of the adjacent ultrasonic receiver may be detected and the focus of the ultrasonic beam is adjusted in response to the movement.

Ultrasonic universal wireless charging

A MEMS device, such as an accelerometer or gyroscope, fabricated in interconnect metallization compatible with a CMOS microelectronic device. In embodiments, a proof mass has a first body region utilizing a thick metal layer that is separated from a thin metal layer. The thick metal layer has a film thickness that is significantly greater than that of the thin metal layer for increased mass. The proof mass further includes a first sensing structure comprising the thin metal layer, but lacking the thick metal layer for small feature sizes and increased capacitive coupling to a surrounding frame that includes a second sensing structure comprising the thin metal layer, but also lacking the thick metal layer. In further embodiments, the frame is released and includes regions with the thick metal layer to better match film stress-induced static deflection of the proof mass.

MEMS devices utilizing a thick metal layer of an interconnect metal film stack

Methods and systems may provide for a hybrid RF MEMS component design including an electrostatic actuation and a piezoelectric actuation. In one example, the method may include applying a first voltage to generate a first piezoelectric force to reduce a first gap between a cantilever and an actuation electrode, and applying a second voltage to generate an electrostatic force to create contact between the cantilever and a transmission electrode.

Hybrid radio frequency component

A Micro-Electro-Mechanical System (MEMS) accelerometer employing a rotor and stator that are both released from a substrate. In embodiments, the rotor and stator are each of continuous a metal thin film. A stress gradient in the film is manifested in capacitive members of the rotor and stator as a substantially equal deflection such that a relative displacement between the rotor and stator associated with an acceleration in the z-axis is substantially independent of the stress gradient. In embodiments, the stator comprises comb fingers cantilevered from a first anchor point while the rotor comprises comb fingers coupled to a proof mass by torsion springs affixed to the substrate at second anchor points proximate to the first anchor point.

Stress tolerant MEMS accelerometer

A MEMS device, such as an accelerometer or gyroscope, fabricated in interconnect metallization compatible with a CMOS microelectronic device. In embodiments, a proof mass has a first body region utilizing a thick metal layer that is separated from a thin metal layer. The thick metal layer has a film thickness that is significantly greater than that of the thin metal layer for increased mass. The proof mass further includes a first sensing structure comprising the thin metal layer, but lacking the thick metal layer for small feature sizes and increased capacitive coupling to a surrounding fame that includes a second sensing structure comprising the thin metal layer, but also lacking the thick metal layer. In further embodiments, the frame is released and includes regions with the thick metal layer to better match film stress-induced static deflection of the proof mass.

Growing community of inventors

Beaverton, OR, United States of America

Rashed Mahameed