Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Commissariat a L'energie Atomique

Raphael Salot

Sami Oukassi

Frederic Gaillard

Steve Martin

Marc Plissonnier

Messaoud Bedjaoui

Nicolas Dunoyer

Jean-Yves Laurent

Emmanuelle Rouviere

Marc Zussy

Philippe Pantigny

Didier Marsacq

Jean-Antoine Gruss

Frédéric Le Cras

Lucie Le Van-Jodin

Pascal Faucherand

Lucie Jodin

Philipp Achatz

Stephanie Roche

A method for encapsulating a microelectronic device, arranged on a support substrate, with an encapsulation cover includes, inter alia, the following sequence of steps: a) providing a support substrate on which a microelectronic device is arranged, b) depositing a bonding layer on the first face of the substrate, around the microelectronic device, c) positioning an encapsulation cover on the bonding layer in such a way as to encapsulate the microelectronic device, d) thinning the second main face of the support substrate and the second main face of the encapsulation cover by chemical etching.

Method for encapsulating a microelectronic device, comprising a step of thinning the substrate and/or the encapsulation cover

The invention relates to an electronic system comprising at least one device comprising a substrate () carrying at least one electronic component provided with at least one electrical connector (), with the system further comprising a support of said device, characterised in that the device comprises at least one passage () according to a dimension in thickness of the device, said passage passing through the electrical connector (), and in that it comprises at least one electrically conductive pillar () protruding on a first face of the support, with the electrically conductive pillar () passing through the passage () by being configured to be in electrical continuity with the electrical connector () passed through by said passage.

Case for microelectronic components

This invention relates to a method for producing an electrical system comprising a support () bearing on a first face at least one device; with the device comprising at least one electronic component () provided with at least one electrical connector (), with the method comprising: a step of setting in place of a cover () positioned above the component; said cover () comprising at least one passage () according to a dimension in thickness of the cover () in such a way as to form an access space to the at least one electrical connector (), a step of forming a sealing seam () in such a way that the component is encapsulated in a sealed cavity () delimited by the first face of the support (), the first face of the cover () and the sealing seam (). The method comprises a step of filling with a conductive material of is at least one passage () of the cover () in such a way as to establish an electrical continuity between the conductive material and the at least one electrical connector (), formant a tapping () and in that the sealing seam () comprises a dielectric material.

Method of making a microelectronic device

The method of producing a device having batteries includes the following successive steps performed on a support substrate:

Method of producing a device having batteries with testing of the operation of the batteries before connecting them electrically

An electrical energy storage and/or generation device with an architecture including a stack of electrical storage and/or generation elements, such as microbatteries. An electrical connection is not made between the different stacked elements during manufacture, but subsequently with assistance of an electronic control unit to configure, in series and/or in parallel, all or a proportion of the elements, and to configure electrical outputs of the device, such as the electrical voltage or the storage capacity.

Architecture with stacking of storage and/or electrical energy generating elements with configurable electrical output, method of producing such an architecture

A microbattery that includes, in succession starting from a first substrate: a first current collector, a first electrode, an electrolyte, a second electrode consisting of a solder joint, a second current collector and a second substrate. Additionally, a method for manufacturing a microbattery, which includes the following steps: forming a thin-film multilayer including, in succession from the first substrate, a first current collector, a first electrode, an electrolyte and a first metal film; forming a second current collector on a face of a second substrate; and forming a second electrode by soldering the first metal film and the second current collector together, said substrates being placed facing each other during assembly.

Microbattery and method for manufacturing a microbattery

The method for eliminating metallic lithium on a support comprises a plasma application step. The plasma is formed from a carbon source and an oxygen source with a power comprised between 50 and 400 W. It transforms the metallic lithium into lithium carbonate. The method then comprises a dissolution step of the lithium carbonate in an aqueous solution.

Method for eliminating metallic lithium

The fluid distribution device includes a first cavity at a first pressure and a second cavity at a second pressure lower than the first pressure. A partition separates the first cavity from the second cavity and a restricting valve is arranged between the first and second cavities. The partition includes a thermoelectric module having a hot side in thermal contact with the first cavity and a cold side in thermal contact with the second cavity.

Fluid delivery device including a thermoelectric module

The microcomponent, for example a microbattery, comprising a stack with at least two superposed layers on a substrate, is made using a single steel mask able to expand under the effect of temperature. The mask comprises at least one off-centered opening. The mask being at a first temperature, a first layer is deposited through the opening of the mask. The mask being at a second temperature, higher than the first temperature, a second layer is deposited through the opening of the mask. Finally, the mask being at a third temperature, higher than the second temperature, a third layer is deposited through the opening of the mask.

Method for producing at least one microcomponent with a single mask

The microbattery is formed by a stack of solid thin layers on a substrate which, starting from the substrate, successively comprises a first electrode, a solid electrolyte and a second electrode/current collector assembly. A first surface and a second surface of the electrolyte are respectively in contact with a main surface of the first electrode and a main surface of the second electrode/current collector assembly. The dimensions of the main surface of the first electrode are smaller than the dimensions of the main surface of said assembly, and the dimensions of the first surface of the solid electrolyte are smaller than the dimensions of the second surface of the solid electrolyte. The solid electrolyte is furthermore not in contact with the substrate.

Lithium microbattery and fabrication method thereof

The lithium-ion microbattery comprises a positive electrode having a first Liion storage capacity and a first thickness made from a first lithium insertion material, an electrolyte and a negative electrode having a second storage capacity and a second thickness made from a second insertion material. The thicknesses are such that the ratio of the first storage capacity over the second storage capacity is greater than or equal to 10 and lower than or equal to 1000. During the first charging of the micro-battery, the Liions are inserted in the negative electrode and completely saturate the second insertion material. When initial charging is continued, they form a metallic lithium layer between the electrolyte and the lithium-saturated negative electrode by electroplating. During the subsequent charging and discharging cycles, only the metallic lithium layer participates in transfer of lithium ions.

Method of operating a non-balanced lithium-ion microbattery

Method for producing a nanostructure based on interconnected nanowires, nanostructure and use as thermoelectric converter The nanostructure comprises two arrays of nanowires made from respectively n-doped and p-doped semi-conducting material. The nanowires of the first array, for example of n type, are formed for example by VLS growth. A droplet of electrically conducting material that acted as catalyst during the growth step remains on the tip of each nanowire of the first array at the end of growth. A nanowire of the second array is then formed around each nanowire of the first array by covering a layer of electrically insulating material formed around each nanowire of the first array, and the associated droplet, with a layer of p-type semi-conducting material. A droplet thus automatically connects a nanowire of the first array with a single coaxial nanowire of the second array. This type of nanostructure can be used in particular to form a thermoelectric converter.

Method for producing a nanostructure based on interconnected nanowires, nanostructure and use as thermoelectric converter

A new anode configuration () is proposed for a lithium microbattery (). The anode () preferably consists of nanotubes or of nanowires () such that the empty space () left between the different components () provides compensation for the inherent swelling upon discharging the microbattery (). With the absence of stresses on the electrolyte (), the lifetime of the battery () may be increased.

Nanostructured electrode for a microbattery

A microbattery has a support having a front face, a rear face, first and second current collectors arranged on the front face. A stack including a cathode and an anode separated by an electrolyte is arranged on the current collectors. The anode and cathode respectively contact the first and second current collectors. A protective layer covers the stack. The microbattery has connections in contact with the first and second current collectors, passing through the support from the front face to the rear face. The stack substantially covers of the front face of the support. A method for producing the mircobattery includes etching cavities, in the front face of the support, having a depth that is smaller than the thickness of the support, filing of the cavities with a conducting material and removing a layer of the rear face of the support to uncover the conducting material in the cavities.

Microbattery comprising through-connections and production method thereof

A microcomponent including: an electrochemical storage source; a first substrate including a first contact face; a second substrate including a second contact face; 'at least one internal cavity formed from a first cavity recessed into the first contact face of the first substrate, or from a second cavity recessed into the second contact face of the second substrate, or from the first cavity recessed into the first contact face of the first substrate and the second cavity recessed into the second contact face of the second substrate, wherein the two substrates are integrated together via their respective contact faces and a sealing member, and said internal cavity contains the electrochemical storage source; and electrical connections between the electrochemical storage source and an external environment.

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Lans-en-Vercors, France

Raphael Salot