Cisco Technology, Inc.

Aayuna Inc.

Triquint Technology Holding Co.

Nsv LLC

Rao Yelamarty

Kalpendu Shastri

Soham Pathak

Bipin Dama

Neeraj Kumar Dubey

Anujit Shastri

Vipulkumar K Patel

Prakash B Gothoskar

Ravinder Kachru

Alan Leonhartsberger

Kishor V Desai

Mark Andrew Webster

Thomas Robert Daugherty

Kaushik Patel

Rutvij Dave

Gnyaneshwar Ramakrishna

David Piede

Timothy Butrie

Weizhuo Li

Fridolin L Bosch

Stephen James Salko

Christina Arnold

Thomas James Miller, Jr

Shaun P Scrak

Neha Kumar

Ankita Shastri

George Edward Andrews

Kal Shastri

Jeremy Lim

Sharvari Harsh Dalal

Terry Ki Lim

David Snyder

Jing-Hua He

Muhammad Arif

Hak Byun

Timothy P Bock

Leo Anthony Procida

Sriram Tyagarajan

Passive alignment and connection between a fiber array and a plurality of optical waveguides terminating along an edge of a photonic IC (PIC) is provided by a controlled mating between alignment V-grooves formed in a fiber array support substrate and extra-array alignment ridges formed beyond the extent of a waveguide array integrated within the PIC. The height and width of the alignment ridges are formed to engage with the alignment V-grooves upon mating of the fiber array substrate with the PIC, providing passive alignment while maintaining a physical gap spacing g between the components (ensuring the integrity of the passive alignment).

Passively-aligned fiber array to waveguide configuration

A hand-held vision sensor apparatus comprises a plurality of light sources, control activation elements and an image sensing array, encased within a housing such that the control activation elements are disposed at a user-accessible location on the housing. The housing further includes a pair of exit apertures for emitting illumination directed toward a medical specimen and an entrance aperture for capturing reflected light from the medical specimen. The light sources are disposed in alignment with the pair of exit apertures, and the image sensing array is aligned with the entrance aperture. The control activation elements are utilized to energize the light sources and control the functioning of the image sensing array. A computer port may be included and used to communicate command controls to the light sources, image sensing array and control activation elements in a manner that allows for a remotely-located technician to communicate with the hand-held vision sensor.

Vision sensor apparatus for medical diagnostic applications

A dual-layer coupling arrangement comprises a first coupling waveguide disposed within a photonic integrated circuit (at a position over an included optical signal waveguide) and a second coupling waveguide disposed above the first coupling waveguide. The first and second coupling waveguides are formed to exhibit splitter configurations that terminate as a pair arms separated by a distance suitable for creating beams that would coincide with a circular mode field of the core region of a coupling optical fiber. The vertical spacing between the first and second coupling waveguides is set so that the pairs of beams exiting from the terminating arms of the coupling waveguides coincide with a circular mode field.

Dual layer optical coupling configuration between photonic integrated circuit and external single mode optical fiber

Passive alignment and connection between a fiber array and a plurality of optical waveguides terminating along an edge of a photonic IC is provided by a controlled mating between V-grooves formed in a fiber support substrate and alignment ridges formed to surround waveguide terminations along an edge of a photonic IC. The V-grooves of the fiber support substrate are spaced to define the same pitch as the waveguides on the photonic IC, with the height and width of the alignment ridges formed to engage with the V-grooves upon mating of the fiber support substrate with the photonic IC. The individual fibers are positioned within associated V-grooves such that their endfaces are retracted from a proximal end portion of the support structure. It is this proximal end portion that mates with the alignment ridges on the photonic IC.

A high density interconnect arrangement takes the form of a backplane-pluggable card, with electrical connections formed along a single (pluggable) edge and all remaining connections provided via optical fibers. An exemplary interconnect arrangement also includes on-board optical sources and silicon photonic-based circuitry for providing optical transceiver functionality. Passively aligned fiber arrays are utilized to provide I/O connections to external elements, as well as between laser sources and on-board silicon photonics.

High density opto-electronic interconnection configuration utilizing passive alignment

Embodiments herein include an optical system, an optical component, and an associated method of passive alignment in which complementary magnetic patterns are used to provide passive alignment between optical elements. The magnetic coupling between the magnetic patterns operates to align optical elements in at least two dimensions. The magnetic coupling provides a temporary holding force on the optical elements until the optical elements are secured using epoxy or other adhesive.

Alignment of optical components using nanomagnets

Embodiments herein include an optical system that passively aligns a fiber array connector (FAC) to a waveguide in a photonic chip. A substrate of the FAC is machined or etched to include multiple grooves along a common axis or plane to hold optical waveguides, or more specifically, the fibers of the optical cables in the FAC. To align the fibers to the photonic chip, one of the fibers is disposed in an alignment trench which has a width that is substantially the same as the diameter of the fiber. When the fiber registers with the alignment trench, the fiber is aligned with a waveguide disposed at the end of the trench. Because the pitch between the fibers can be precisely controlled, aligning one of the fibers using the alignment trench results in the other fibers becoming passively aligned to respective waveguides in the photonic chip.

Passive fiber optic butt coupling using a semiconductor etched feature

Embodiments herein include an optical system that passively aligns an optical component (e.g., a fiber array connector, lens array, lens body, etc.) with a semiconductor substrate using trenches that mate with optical fiber stubs. In one embodiment, the trenches are etched into the semiconductor substrate which provides support to optical devices (e.g., lasers, lens arrays, photodetectors, etc.) that transmit optical signals to, or receive optical signals from, the optical component. An underside of the optical component is etched to include at least two grooves (e.g., V-grooves) for receiving optical fiber stubs. In one embodiment, the optical fiber stubs are a portion of optical fiber that includes the core and cladding but not the insulative jacket. Once the fiber stubs are attached to the grooves, the fiber stubs are disposed into the trenches in the semiconductor substrate thereby passively aligning the optical component to the optical device on the substrate.

Passive alignment of optical components using optical fiber stubs

Embodiments described herein describe a sub-mount that is etched to include respective cavities with at least two adjacent sides that align optical filters and a mirror. Moreover, the cavities are arranged on the sub-mount such that when the filters and mirror are disposed in the cavities, they align in a manner that enables the performance of a multiplexing or demultiplexing function as part of, for example, a zigzag multiplexer/demultiplexer. In one embodiment, the filters and mirrors are aligned passively rather than actively. The sub-mount may then be placed on a substrate that includes other components of a ROSA or TOSA. In one embodiment, the substrate is also etched to include a cavity two adjacent sides to align the sub-mount so that sub-mount is passively aligned once disposed into the cavity.

Aligning optical components in a multichannel receiver or transmitter platform

A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a 'platform' (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.

Wafer scale packaging platform for transceivers

An optical receiver having a silicon substrate with a top surface cleaved from a &lsqb;100&rsqb; silicon crystallographic plane and a reflector, and a photodetector coupled to the top surface of the silicon substrate, the photodetector being adapted to receive an incoming signal from a fiber.

Off-axis silicon substrate for optimized optical coupling

An uncooled, through-hole configured laser module adapted to receive and transmit RF signals to a laser at bandwidths from direct current (DC) to about ten gigahertz. The laser module incorporates an option for two pin-out configurations. One pin-out configuration has one ground pin and one signal pin for operation at about one gigabit/second or one gigahertz. The second high performance pin-out uses two ground pins and one signal pin for operation up to about ten gigabit/second or ten gigahertz.

Uncooled universal laser module

Growing community of inventors

Allentown, PA, United States of America

Rao Yelamarty