International Business Machines Corporation

The Carborundum Company

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Rao Venkateswara Vallabhaneni

Shaji Farooq

Govindarajan Natarajan

Srinivasa S N Reddy

John Ulrich Knickerbocker

Benjamin V Fasano

Subhash Laxman Shinde

Lester W Herron

David B Goland

Lawrence D David

Donald Rene Wall

Srinivasa S Reddy

Gregory M Johnson

Anthony Mastreani

Farid Youssif Aoude

Jon Alfred Casey

Robert Hannon

Niranjan Mohanlal Patel

Jonathan H Harris

Robert A Youngman

Andrew Michael Reitter

Carla Natalia Cordero

Richard A Shelleman

Robert Anthony Rita

Richard Francis Indyk

Scott Ira Langenthal

Renuka S Divakaruni

Lisa M Studzinski

Vivek M Sura

Hal Mitchell Lasky

Young-Ho Kim

Thomas M Shaw

George Frederick Walker

Raschid Jose Bezama

Emanuel Israel Cooper

Sarah Huffsmith Knickerbocker

James N Humenik

Peter Richard Duncombe

Jae M Park

Jungihl Kim

Sundar M Kamath

Robert R Shaw

Michael A Cohn

Mark O Neisser

David H Gabriels

Edward A Giess

Friedel Muller-Landau

Jon A Van Hise

James M Brownlow, Deceased

David Clifford Long

Thomas Edward Lombardi

Robert William Pasco

Suryanarayana Kaja

Ajay Prabhakar Giri

Brenda Lee Peterson

Jawahar P Nayak

Renee L Weisman

Umar M Ahmad

Michael E Cropp

James C Utter

Joseph P DeGeorge

Gerald H Leino

John A Trumpetto

Deborah Anne Sylvester

Nancy A Wier-Cavalieri

Srinivasan N Reddy

James M Blazick

Frank V Ranalli

Nancy C Stoffel

The present invention relates generally to a new dielectric forming metal/ceramic laminate magnet and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area laminate magnet with a significant number of holes, integrated dielectric forming metal plate(s) and electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display and electron beam source and methods of manufacture thereof.

Discrete magnets in dielectric forming metal/ceramic laminate and process thereof

A plate for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which apertures in a set of greensheets are formed by a material removal process, at least some of the apertures being filled with a fugitive material that escapes during sintering.

Method of forming a plate for dispensing chemicals

The present invention relates generally to a new metal/ceramic laminate magnet and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area laminate magnet with a significant number of holes, integrated metal plate(s) and electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display and electron beam source and methods of manufacture thereof.

Process of forming metal/ferrite laminated magnet

A cost-effective surface metallization structure of a TCA carrier is produced by using a high-grit conducting paste to fill TSM vias in the TSM of the TCA carrier. This concept can be applied to alumina substrates with refractory metal conductors or to LCGC substrates with more noble metal conductors.

Surface metallization structure for multiple chip test and burn-in

A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.

Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias

A semiconductor chip interposer increases fatigue life of interconnections between a first component having a relatively high thermal coefficient of expansion (TCE) and a second component having a relatively low TCE. The semiconductor chip interposer includes a thin metal plate having a plurality of through holes, the thin metal plate having a TCE intermediate the relatively high TCE and the relatively low TCE. An insulation coating on the thin metal plate is also included on walls of the through holes. An electrical conductive material fills each of the insulated through holes for electrical interconnection between the first component and the second component.

Enhanced interconnection to ceramic substrates

Disclosed is a multilayer ceramic substrate having an outer pad, for example an I/O pad, which is anchored to a middle pad of the multilayer ceramic substrate by a plurality of vias which in turn is anchored to an inner pad of the multilayer ceramic substrate by a second plurality of vias. The middle and outer pads and vias are made of high metal material, preferably 100% metal, so they won't adhere very well to the ceramic substrate. The inner pad is a composite metal/ceramic material which will bond very well to the ceramic substrate.

Multilayer ceramic substrate with anchored pad

A process for fabricating a microelectronic structure. The process comprises processing a metal carrier having a top surface and a bottom surface, wherein the top surface and the bottom surface are processed to promote adhesion, forming a dielectric layer around the metal carrier, wherein the dielectric layer substantially covers the top surface and the bottom surface of the metal carrier, and applying a first patterned layer of conductive material to the microelectronic structure. In one preferred embodiment, the process further comprises comprising sintering the metal carrier, the dielectric layer, and the first patterned layer of conductive material. In one preferred embodiment, the process further comprises forming a via hole through the metal carrier before the forming of the dielectric layer around the metal carrier, wherein the forming of the dielectric layer comprises forming the dielectric layer inside the via hole.

Structure and process for making substrate packages for high frequency application

A process of forming a multi-layer feature on a ceramic or organic article in which first and second layers of paste are sequentially screened through a screening mask wherein the screening mask has not been moved between screening steps. A structure produced by this process is also disclosed.

Single mask screening process

A method of and novel composition for transient liquid phase bonding of refractory metal structures is described herein. Preferably, the composition comprises a first component substantially similar to the composition of the refractory metal structure, and a second component having a lower melting temperature than the first component comprising a metallic constituent selected from the group consisting of iron, nickel and cobalt. The second component acts as a melting point depressant to temporarily lower the melting point of the first component so that the join can be accomplished without melting the structure itself. Upon applying the composition to the surfaces of refractory metal structures in need of joining, the assembly is heated to a eutectic point defined as the lowest melting point of the composition. A localized liquid region is formed at the interface of the two structures which solidifies when the second component diffuses into the structures such that the region becomes increasingly refractory thereby solidifying into a substantially refractory joint.

High temperature refractory joining paste

Disclosed is a multilayer ceramic substrate having an outer pad, for example an I/O pad, which is anchored to an inner pad of the multilayer ceramic substrate by either a plurality of vias or one large via. The outer pad and vias are made of high metal material, preferably 100% metal, so they won't adhere very well to the ceramic substrate. The inner pad is a composite metal/ceramic material which will bond very well to the ceramic substrate.

Copper-based paste containing copper aluminate for microstructural and

Metal pastes used in the fabrication of multilayer ceramic (MLC) substrates used in semiconductor devices. The pastes reduce substrate defects, such as via bulge and camber. The pastes are comprised of a metal having high conductivity, frit which includes glass, an organic binder, and a solvent, optionally with a surfactant.

Pastes for improved substrate dimensional control

A multilayer ceramic substrate electronic component is provided having high temperature superconductor material circuitry. The high temperature superconductor material is preferably yttrium-barium-copper-oxide and is encased within a noble metal such as silver or gold when forming the surface circuitry or filling of the vias. The noble metal layers preferably have through-openings to enable direct connection of circuitry to the encased superconductor layer. A method is also provided for fabricating such multilayer ceramic substrate electronic components.

Multi-layer glass ceramic module with superconductor wiring

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Hopewell Junction, NY, United States of America

Rao Venkateswara Vallabhaneni