Shanghai Zhaoxin Semiconductor Co., Ltd.

Ranyue Li

Jie Jin

Junping Li

Xiaolong Zhang

Mintao Tang

A data link layer device and a packet encapsulation method are provided. The data link layer device includes a first and a second first-in-first-out (FIFO) module. The first FIFO module receives and stores multiple first data from an upper-layer module, and removes data gaps from the first data to store the first data in a continuous form. When the first FIFO module is not empty, the first FIFO module generates data of different lengths based on the current amount of data stored temporarily in the first FIFO module and a preset data length. When the data queue of the second FIFO module has enough space to receive the first data, the first FIFO module transfers the first data to the second FIFO module, and the first FIFO module transfers a header including the data length to a header queue of the second FIFO module.

Data link layer device and packet encapsulation method thereof

A ring bus and a credit allocation method are provided. The ring bus includes a slave module and multiple master modules. The slave module includes an injection table and a state table, and is configured to generate a credit signal including a node identity and an active code. The master modules are coupled to the slave module to form a ring path. The slave module determines whether the credit signal is a newly injected credit signal, and determines the node identity of the credit signal according to the injection table or the state table. The slave module transmits the credit signal to the master module corresponding to the node identity through the ring path according to the node identity. The slave module uses a corresponding idle entry to receive a credit request signal provided by the master device consuming a credit of the credit signal.

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Shanghai, China

Ranyue Li