Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies Ecbu IP (singapore) Pte. Ltd.

Avago Technologies IP (singapore) Pte. Ltd.

Rani Ramamoorthy Saravanan

Wee Sin Tan

James Costello

Yufeng Yao

Boon Keat Tan

Pak Hong Yee

Chi Boon Ong

Kuldeep Kumar Saxena

Chee Heng Wong

Peng Yam Ng

Sze Ping Ong

Kai Koon Lee

Han Kang Chong

Yee Pak Hong

Ng Peng Yam

Tan Wee Sin

Tan Soon Lee

Chen Deng Peng

An optical proximity sensor is provided that comprises an infrared light emitter an infrared light detector, a first molded optically transmissive infrared light pass component disposed over and covering the light emitter and a second molded optically transmissive infrared light pass component disposed over and covering the light detector. Located in-between the light emitter and the first molded optically transmissive infrared light pass component, and the light detector and the second molded optically transmissive infrared light pass component is a gap. Layers of infrared opaque, attenuating or blocking material are disposed on at least some of the external surfaces forming the gap to substantially attenuate or block the transmission of undesired direct, scattered or reflected light between the light emitter and the light detector, and thereby minimize optical crosstalk and interference between the light emitter and the light detector.

Infrared attenuating or blocking layer in optical proximity sensor

An optical proximity sensor and housing for the same are disclosed. The housing is provided with at least two support structures and at least two modules. A first of the support structures transfers vertical forces applied to one end of a module to an opposite end of the opposite module. A second of the support structures inhibits a pivoting of the modules about the first support structure.

Housing for optical proximity sensor

An optical proximity sensor is provided that comprises an infrared light emitter an infrared light detector, a first molded optically transmissive infrared light pass component disposed over and covering the light emitter and a second molded optically transmissive infrared light pass component disposed over and covering the light detector. Located in-between the light emitter and the first molded optically transmissive infrared light pass component, and the light detector and the second molded optically transmissive infrared light pass component is a substantially optically non-transmissive infrared light barrier component. The infrared light barrier component substantially attenuates or blocks the transmission of undesired direct, scattered or reflected light between the light emitter and the light detector, and thereby minimizes optical crosstalk and interference between the light emitter and the light detector.

Optical proximity sensor package with molded infrared light rejection barrier and infrared pass components

A proximity sensor device is provided in compact unit that has the ability to sense or monitor in different directions, such as sensing or monitoring in both the vertical and horizontal directions. Methods are also provided. In an illustrative embodiment, the proximity sensor device includes a first transmitting/receiving pair and a second transmitting/receiving pair on a printed circuit board along with an IC to control the transmitters and receivers, as well as, in some embodiments, to provide signal filtering, amplification or other desired features.

Compact multi-direction proximity sensor device and method

An optical proximity sensor and corresponding methods of measuring crosstalk in the sensor are disclosed. The amount of crosstalk generated between the light emitter and the light detector of an optical proximity sensor is measured and quantified according to one of two methods. The measured crosstalk may then be stored in a register or memory location and then subtracted from signals representative of signals indicative of the nearby presence of an object to be detected combined with crosstalk, thereby removing so the contribution or effect of crosstalk on such signals.

Methods, systems and devices for crosstalk measurement and cancellation in optical proximity sensors

In an embodiment, the invention provides a proximity sensor including a transmitter die, a receiver die, an ASIC die, a lead frame, wire bonds, a first transparent encapsulant, a second transparent encapsulant, and an opaque encapsulant. The transmitter die, the receiver die and the ASIC die are attached to portions of the lead frame. Wire bonds electrically connect the transmitter die, the receiver die, the ASIC die, and the lead frame. The first transparent encapsulant covers the receiver die, the ASIC die, the wire bonds, and a portion of the lead frame. The second transparent encapsulant covers the transmitter die, the wire bonds, and a portion of the lead frame. The opaque encapsulant covers portions of the first and second encapsulants and a portion of the lead frame.

Small low-profile optical proximity sensor

A touch input system includes a light-emitting device, a bent light guide and a light detector. The light-emitting device emits light. The bent light guide receives the light emitted by the light-emitting device and guides the light to travel in a direction across a face of a display screen. The light detector detects the light.

Touch input system using light guides

In one embodiment, the transmitters and detectors for an integrated optical touch panel (OTP) are mounted at right angles to the surface of the OTP. The transmitters and detectors are contained on a substrate which is an extension of the substrate containing the touch panel display itself. The sides of the substrate containing the transmitters and detectors are folded upward so that the transmitters and detectors are positioned above the plane of the substrate containing the display.

Growing community of inventors

Singapore, Singapore

Rani Ramamoorthy Saravanan