Oceanit Laboratories, Inc.

Randy Wolfshagen

Basil Henry Scott

Christopher J Sullivan

Robert E Swanson

Ken C K Cheung

Ronald L Seiple

Paul Pernambuco-Wise

S Maile Giffin

Jeff Buck

Andy Crahan

Justin Eiler

The disclosure relates to optical sensing for both near and far field imaging at different speeds. In particular, disclosed herein is a novel adaptive, high speed optical digital Sensor Chip Assembly (SCA) that can be used in a variety of sensing applications. Specifically disclosed is an optical sensor, referred to herein as the 'Oceanit Digital Sensor,' which comprises a SCA. This SCA includes a focal plane array (FPA) connected, or “hybridized,” to a digital read out integrated circuit (DROIC) through various micro-connections, thereby resulting in a multi-layered assembly. The FPA is a light sensitive layer that converts incoming photons of light to electronic charges, which the DROIC then collects, processes, and converts into a digital output stream. The DROIC includes a matching array of charge-to-voltage integrating amplifiers, as well as other circuits, to support the conversion of the light received on the FPA into a representative data stream.

Adaptive, high speed optical digital sensor chip assembly for temporal sensing applications

An event detection and classification system uses a new type of optical sensing component, a Position Sensing Detector Focal Plane Array (PSD-FPA). The PSD-FPA provides for high-speed operation that allows for accurate sensing of fast artifacts that are unique to weapons fire and enables precise location of optical phenomenon. The system detects and classifies events, particularly weapons fire, and rejects false alarms. An optical lens sub-system focuses light onto a PSD-FPA, which senses the photons and generates electrical signals associated with individual elements of the PSD-FPA. These signals are processed to identify and classify weapons-related or other events. Background subtraction, variable gain, time-intensity and time-location correlation, digital filtering, Fourier analysis, and wavelet analysis are all used to successfully classify the events while rejecting false alarms.

Position sensing detector focal plane array (PSD-FPA) event detection and classification system

A single focal plane integrated circuit hybrid replaces multiple focal plane circuits and associated off-focal plane signal processing electronics. A dual function, dual color focal plane PSD sensor chip assembly includes a PSD array, a traditional pixelized camera array, a signal processing chip, and flip-chip interconnects and wirebond pads to support electronics on the signal processing chip. The camera array is made of a material sensitive to wavelengths longer than the PSD array material is sensitive to. The PSD array is disposed in the same substrate as the camera array. The PSD array tracks object locations and directs the camera array to window and zoom while capturing images. Inherent registration of PSD cells to the pixelized camera array makes responsivity map testing and spatial calibration unnecessary. Reduction in power dissipation is achieved by powering on the camera array only when the PSD detects a change in scene.

Dual color/dual function focal plane

A real-time in-situ sensor system is provided for measurement of bioluminescence and determination of bioluminescence surface signature. The system measures bioluminescence in the wake of a submerged moving object as well as ambient light levels outside of the wake. Along with measurements of depth and water-quality parameters including turbidity, temperature and salinity, the surface signature of the induced underwater bioluminescence can be calculated by considering light transmission and attenuation through water. With this real-time information, the operator of the submerged moving object can employ tactical maneuvers to affect the resultant surface signature.

Sensor system for real-time bioluminescence signature determination

A Sensor Chip Assembly (SCA) contains a focal plane array constructed as a semiconductor chip sandwich. One slice contains an array of PSDs made from IR sensitive semiconductor material, and the other slice contains Trans Impedance Amplifiers (TIAs)&#x2014;and associated on-chip signal processing elements from an electronic semiconductor material. The SCA resembles those made for pixelized imaging IR SCA focal planes, but the configuration and implementation of which is for a PSD focal plane array. The use of these techniques assures that the PSD focal plane array possesses the required attributes. Interconnect technology is widely available from most IR fabrication houses to connect the IR array with the TIA circuits.

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Koloa, HI, United States of America

Randy Wolfshagen