Alliant Techsystems Inc.

Randy L Everton

Mont A Johnson

Peter Totman

Mark R Eggett

David J Macon

Marvin D Bunderson

Mark R Egget

Randy L Borgstrom

Douglas E Smith

Paul A St Jean

A method and apparatus for detecting and determining event characteristics such as, for example, the material failure of a component, in a manner which significantly reduces the amount of data collected. A sensor array, including a plurality of individual sensor elements, is coupled to a programmable logic device (PLD) configured to operate in a passive state and an active state. A triggering event is established such that the PLD records information only upon detection of the occurrence of the triggering event which causes a change in state within one or more of the plurality of sensor elements. Upon the occurrence of the triggering event, the change in state of the one or more sensor elements causes the PLD to record in memory which sensor element detected the event and at what time the event was detected. The PLD may be coupled with a computer for subsequent downloading and analysis of the acquired data.

Method and apparatus for detecting and determining event characteristics with reduced data collection

An apparatus for measuring stress is provided that includes a stress sensor including, in part, a sensing device configured for generating and outputting sensor measurement signals representative of a stress or a component of a stress. In one embodiment, the stress sensor permits sensing and measurement of a shear component of a stress substantially exclusive of a normal component thereof. The stress sensor may be suited for measuring stress between mated bodies, such as at an interface between the mated bodies. A method of measuring stress using the stress sensor and a rocket motor including at least one stress sensor are also provided.

Apparatus and method for measuring stress at an interface

An instrument pin member is provided that is capable of measuring bending moments and optionally of measuring bending and axial strain in real or near real time. The instrumented pin member includes a pin member body disposed about a pin member axis, wherein the pin member body includes a bending portion. A sensing device is positioned at the pin member body within the bending portion for sensing a bending strain in the bending portion exclusive of a net axial strain, and for outputting a sensor measurement signal representative of the bending strain. A sensor measurement signal output device is provided for outputting the sensor measurement signal from the sensing device. A related system includes a plurality of pin members, among other things. Related methods also are disclosed.

Method and apparatus for measuring bending in a pin member

A stress sensor is provided that is suited for measurement of stress between adjacent mated bodies, such as at an interface. The stress sensor permits measurement of stress, preferably a shear component of the stress substantially exclusive of the normal component. A system including the stress sensor and a method of measuring stress, especially the shear component of stress, using the sensor are also provided.

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Brigham City, UT, United States of America

Randy L Everton