Semitool, Inc.

Applied Materials, Inc.

Other

Rockwell Collins, Inc.

Randy Harris

Daniel J Woodruff

Paul Zachary Wirth

Robert B Moore

Jeffry Alan Davis

Kyle Moran Hanson

Gregory J Wilson

Ludovic Godet

Srinivas D Nemani

Douglas A Buchberger, Jr

Paul R McHugh

Qiwei Liang

Viachslav Babayan

Vincent Dicaprio

Alpay Yilmaz

James J Erickson

Daniel P Bexten

Steve L Eudy

David Silvetti

Avinash Shantaram

Coby Scott Grove

Amir Nissan

Thomas H Oberlitner

Brian Aegerter

Jitendra Ratilal Bhimjiyani

Bryan Puch

David S Peterson

Curtis A Weber

Niranjan Pingle

Douglas W Carr

Raymon F Thompson

Thomas Lee Ritzdorf

Satish Sundar

Marvin L Bernt

Richard W Plavidal

Mario David Silvetti

Dana R Scranton

Jason A Rye

Jeffrey I Turner

Vincent Steffan Francischetti

Adam Marc McClure

Matthew C Egloff

Bridger Earl Hoerner

Michael Windham

David P Mattson

Andrew Anten

Tim McGlenn

David A Buckmiller

Timothy A Anderson

Thomas Peter Skowyra

Layne H Thorup

Ryan Pfeifle

David Quinn LeBaron

Steven A Peace

Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates includes: an equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates; and a plurality of automation modules coupled to each other and having a first automation module coupled to the EFEM, wherein each of the plurality of automation modules include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot configured to transfer the one or more types of substrates, wherein at least one of the plurality of automation modules include a bonder chamber and at least one of the plurality of automation modules include a wet clean chamber.

Modular mainframe layout for supporting multiple semiconductor process modules or chambers

Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates, includes: a first equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates, a second EFEM having one or more loadports; and a plurality of atmospheric modular mainframes (AMMs) coupled to each other and having a first AMM coupled to the first EFEM and a last AMM coupled to the second EFEM, wherein each of the plurality of AMMs include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot, the one or more process chambers, and a buffer disposed in an adjacent AMM of the plurality of AMMs.

Methods and apparatus bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing a substrate includes: an equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates; and a plurality of automation modules coupled to each other and having a first automation module coupled to the EFEM, wherein each of the plurality of automation modules include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer configured to hold a plurality of the one or more types of substrates, and wherein the transfer chamber includes a transfer robot configured to transfer the one or more types of substrates between the buffer, the one or more process chambers, and a buffer disposed in an adjacent automation module of the plurality of automation modules.

Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

Method and apparatus for post exposure processing of photoresist wafers

In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.

Microelectronic substrate electro processing system

Methods of wetting a semiconductor substrate may include forming a controlled atmosphere in a processing chamber housing the semiconductor substrate. The semiconductor substrate may define a plurality of features, which may include vias. The methods may include flowing a wetting agent into the processing chamber. A chamber pressure may be maintained below about 100 kPa. The methods may also include wetting the plurality of features defined in the substrate.

Systems and methods for wetting substrates

A system and related method for simulating IR halos in a computer graphics display generates a set of halo candidates corresponding to each new scene by scanning the frame buffer for that scene to flag pixels associated with unocculted light sources as halo candidates, or prospective halo centers around which simulated halos are to be drawn. The system adjusts the defocus value of flagged halo candidates based on their pixel distance and determines whether identified halo centers are new, continuing, or expired by comparing the current scene and its halo candidate list to the preceding (currently displayed) image and its list of current halo centers. The system generates a dual visible/IR image, adding IR-only polygonal halos to the identified halo centers based on pixel attributes. The dual image is projected for viewing by night vision goggles, which the IR-only image and component halos will stimulate.

System and method for simulating infrared (IR) light halos in a computer graphics display

A wafer is placed into a chuck assembly within an electroplating system. The chuck assembly includes a backing plate assembly engageable with a ring. A hub may be provided on one side of the backing plate assembly for attaching the chuck assembly to a rotor of a processor for electroplating a wafer. A wafer plate may be provided on the other side of the backing plate assembly. The ring has contact fingers electrically connected to a ring bus bar, and with the ring bus bar electrically connected to a power source in the processor via the backing plate assembly when the ring is engaged to the backing plate assembly. A wafer seal on the ring overlies the contact fingers. A chuck seal may be provided around a perimeter. Maintenance of the electrical contacts and the seal is performed remotely from the processors.

Wafer electroplating chuck assembly

A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.

Wafer processing system with chuck assembly maintenance module

An electroplating apparatus has a rotor in a head, with a contact ring on the rotor. A lift/rotate actuator may move the head to position a sector of the contact ring into a deplate channel of a deplating station. Electrical current and a deplate liquid are applied directly onto the contacts of the contact ring, from a position radially inward of the contacts. Electrical current and a deplate liquid may also be separately applied onto the back side of the ring contact, from a position radially to the outside of the contact ring. A seal on the deplating station makes sliding contact with the contact ring as the contact ring rotates through the deplate channel, with the seal associated with an exhaust or vacuum opening that pulls deplating and rinse liquid through openings in the contact ring.

Electroplating apparatus with contact ring deplating

Growing community of inventors

Kalispell, MT, United States of America

Randy Harris