Tyco Electronics Corporation

Randy Daering

Wayne Montoya

Scott Hetherton

Thomas Bruguier

Daniel A Chandler

Matthew Peter Galla

James J Toth

A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices. The assembly is made by providing first and second laminates, each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface of the stack, and making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.

Process for manufacturing a composite polymeric circuit protection device

A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices (). The assembly is made by providing first and second laminates (), each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack () in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface () of the stack, and making a plurality of electrical connections () between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior. Additional electrical components may be attached directly to the surface of the device or assembly.

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Waukesha, WI, United States of America

Randy Daering