Alien Technology Corporation

Randolph W Eisenhardt

Mark Alfred Hadley

Gordon S W Craig

Paul Stephen Drzaic

Glenn Wilhelm Gengel

Susan Swindlehurst

Scott John Herrmann

Ali A Tootoonchi

Ming X Chan

Scott Hermann

Aly Tootoochi

Anno Hermanns

Apparatuses and methods for high speed bonding for an RFID device are provided. A first substrate includes an antenna and is coupled to a strap assembly by an adhesive material. The adhesive material is substantially inert thermally for a predetermined temperature range, or it otherwise lacks a heat flow variation greater than 0.05 W/g for the predetermined temperature range. Such an adhesive material provides a reliable bond. In a specific embodiment, the predetermined temperature range is about 30&#xb0; Celsius to about 85&#xb0; Celsius. In an alternative embodiment, the adhesive material can be exposed to water or steam to reduce its heat flow variation to less than 0.05 W/g for the temperature range.

Apparatuses and methods for high speed bonding

Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional components having integrated circuits. A local printing system equipped with a print head that dispenses the selected material is used to print. The print head is coupled to a guidance system capable of registering an alignment feature on the web substrate.

Assembly comprising functional devices and method of making same

An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.

Apparatus incorporating small-feature-size and large-feature-size components and method for making same

A flexible electronic, Radio Frequency Identification (RF ID) or display device and methods of making the same. The flexible electronic, Radio Frequency Identification (RF ID) or display device comprises a flexible substrate having a top surface and a bottom surface. The top surface comprises electrical components. The flexible substrate comprises openings cutting therethrough from the top surface to the bottom surface. A conductive layer is coupled to the flexible substrate wherein the openings expose at least a portion of the conductive layer. The openings are filled with conductive elements to make first electrical contacts to at least a portion of the conductive layer and second electrical contacts to the electrical components on the flexible substrate.

Electrical contacts for flexible displays

Method and apparatus for electrical devices. An electronic assembly comprises at least one object having a first electrical circuitry therein. The object is created and separated from a host substrate. The assembly further comprises a receiving substrate having at least one recess. A bottom conducting layer is deposited over the receiving substrate and the recess. The object is then coupled to the receiving substrate such that the object is deposited on the bottom conducting layer and recessed within the first recess and below a surface of the receiving substrate. An insulation layer having a plurality of vias is disposed over the receiving substrate to insulate the bottom conducting layer and the object. A top conducting is deposited over the insulation layer and is making electrical interconnections to the bottom conducting layer and the object through the vias.

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Fargo, ND, United States of America

Randolph W Eisenhardt