Aavid Thermalloy, LLC

Aavid Engineering, Inc.

Aavid Thermal Products, Inc.

Randolph H Cook

Bradley Robert Whitney

Sukhvinder Singh Kang

John R Cennamo

Chad Turmelle

Mark Pelillo

Joseph Jones

Daniel Price

Victor Strack

Jack Churchill

Andrea Sce

Marina Fernández Osorio

A heat transfer device such as a heat sink includes one or more fins for dissipating heat received from a heat source, such as an integrated circuit or other electronic component. A thermosiphon component including a tube that defines a closed, continuous loop and contains a working fluid is attached to a face of a corresponding fin and is arranged to operate as a two-phase thermosiphon to transfer heat across areas of the fin. The heat transfer may equalize temperatures across the fin, enhancing efficiency.

Heat dissipating fin with thermosiphon

Method and assembly for attaching a heat sink to a heat source surface associated with a printed circuit board or other component having a heat source. A fastener assembly may include a push pin with a barbed, bifurcated end arranged to be inserted through an opening of the printed circuit board and thereby secure the heat sink to the printed circuit board. A stopper may be headless, be separable from the push pin, and have a portion, such as a barrel-shaped element, positionable in a throughbore of the push pin that supports the bifurcated end so that movement of the barbed portions toward each other is resisted, thereby securing engagement of the barbed portions with the printed circuit board.

Fastener assembly and method for heat sink mounting

A fluid-containing cooling plate includes a bottom plate, a top plate, and metal wire or tubing formed into a circuit and sandwiched between the plates to form a chamber. The wire is plated or otherwise coated with a brazeable or solderable alloy which bonds it to the plates when the assembly is heated, thereby sealing the chamber. To make a two-phase cooling plate, slugs of plated metal are placed in the chamber and are bonded to the plates to provide support against collapse. The chamber is provided with a wicking structure, and is partially filled with an evaporable fluid via an inlet. A partial vacuum is then drawn, and the inlet is closed off. To make a single-phase cooling plate, wire partitions serving as baffles are provided in lieu of the slugs. These partitions can be arranged to provide a serpentine flow path between the inlet and an outlet, and are likewise plated with an alloy which melts to bond them to the plates.

Fluid-containing cooling plate for an electronic component

A torsion bar clamp device and method for mounting a heat sink to an electronic component comprising a torsion bar having a longitudinally extending bar and at least one integral lever adapted to engage a heat sink and mounting legs which couple forces imparted by the torsion bar to the heat sink and electronic component such that the heat sink and electronic component are compressively coupled. The invention may be manufactured of injection molded plastic and may be adapted to allow the mounting legs to engage bosses on a socket in which an electronic component is mounted.

Torsion bar clamp apparatus and method for improving thermal and mechanical contact between stacked electronic components

A reverse cantilever spring clip for providing intimate thermal contact between a heat sink and a heat generating electrical component such as an integrated circuit (IC). The spring clip includes a spring member and a retention member. The retention member has one or more legs with a securing member affixed to an outer end of the legs. The legs are configured for engaging a heat sink and a circuit board to which the IC is mounted so that the heat sink is positioned directly over the circuit board. The securing member maintains contact between the IC and heat sink.

Reverse cantilever spring clip

Torsion bar clamp apparatus and method for improving thermal and

A spring clamp device providing a compressive stress to a stack of components includes a spring member and a bracket having attachment structure for engaging mating structure near the bottom of the stack. The bracket is first engaged with the mating structure such that it straddles the stack. The spring member is then latched to the bracket under tension in an assembled configuration, thereby applying an upward reaction on the mating structure with the attachment structure of the bracket and applying a downward reaction force to the top of the stack with the spring member. The oppositely directed forces apply a compressive stress to the stack, which improves thermal contact between the components.

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Gilford, NH, United States of America

Randolph H Cook