Lam Research Corporation

Ichor Systems, Inc.

Randolph E Treur

Stephen Mark Smith

Chris Melcer

Todd Mark Cushman

Haruyuki Kubota

Phillip Ryan Barros

John Boyd

Stephen Carson

Fred Conrad Redeker

John Martin De Larios

Michael Ravkin

William Thie

John M Boyd

Stephan H Wolf

Philip Ryan Barros

Tom Anderson

Afshin Nickhou

Michael Vogtmann

Fluid delivery systems are important component assemblies used for semiconductor fabrication. These fluid delivery systems rely on assemblies of components, requiring seals which must be installed and replaced during assembly and maintenance of the fluid delivery systems. Seals may be arranged as seal rings which engage substrate blocks or active components, the seal rings having seal retention features which aid in assembly. These seal retention features may increase the retention force of the seal in a seal cavity or may reduce the force required to retain the seal. In other arrangements, the seal cavities of the substrate blocks or active components may incorporate seal retention features.

Fluid delivery system

A method of processing semiconductors using a fluid delivery system is disclosed in which seal inserts are utilized to fluidly connect an active component that bridges two substrate blocks.

Method of manufacturing semiconductors using fluid delivery system

A substrate block for a fluid delivery system is provided, the substrate block having an upper surface. The upper surface has an inlet substrate port and an outlet substrate port formed into the upper surface. A substrate fluid passageway extends from the inlet substrate port and the outlet substrate port. The substrate fluid passageway extends in a smooth arc which is free of corners or angular walls.

Apparatuses for controlling fluid flow are important components for delivering process fluids for semiconductor fabrication. These apparatuses for controlling fluid flow require a variety of fluid flow components which are tightly packaged within the apparatuses for controlling flow. Servicing the apparatuses requires specialized equipment and methods which enable installation of seals in close quarters in apparatuses which are installed in the field. Seal retainers may be used to retain the seals during assembly of fluid flow components into apparatus for controlling flow.

Seal retainer for a component assembly and method of installing a component into an apparatus for controlling flow

A fluid delivery system may include a substrate block having an upper surface; a first substrate port in the upper surface; a second substrate port in the upper surface; a substrate fluid passageway extending between the first substrate port and the second substrate port; a substrate ring defining the second substrate port; and a substrate seal channel formed in the upper surface and surrounding the substrate ring. An outer surface of the substrate ring may form an inner surface of the substrate seal channel. An active component may be selected from a flow controller, a pressure transducer, a flow measurement sensor, a pressure regulator, a valve, and a flow meter. The active component may comprise a lower surface; a first component port in the lower surface; a component fluid passageway; a component ring; and a component seal channel formed in the lower surface and surrounding the component ring.

Liquid delivery system

A method for rinsing a semiconductor wafer in a module utilizing a fluid delivery ring is provided. The method includes providing a process bowl having a generally circular shape bottom wall, a sidewall that extends upwardly from the bottom wall to define a cylindrical chamber, and a plurality of channels in the sidewall that extend from the bottom wall to an upper edge of the sidewall. A fluid delivery ring is attached onto the sidewall of the process bowl. Utilizing the process bowl, a plurality of supply tubes is inserted into the fluid delivery ring. The fluid delivery ring has a plurality of ring inlet and outlet pairs and a plurality of respective slots. Fluid is supplied to the supply tubes, and fluid is directed onto a surface of the semiconductor wafer defined within the process bowl.

Fluid delivery ring and methods for making and implementing the same

An apparatus for brushing a surface of a substrate is provided. The apparatus includes a brush for scrubbing the surface of the substrate, a head for holding the brush, and an arm. The arm is configured to hold the head about a connection point. The arm is connected to an oscillating mechanism configured to cause the head to oscillate at an angle of rotation about the connection point.

Apparatus for oscillating a head and methods for implementing the same

A method for spinning a wafer to enable rinsing and drying is provided. The method includes engaging the wafer at a wafer processing plane and spinning the wafer. The method further includes moving a wafer backside plate from a first position to a second position as spinning of the wafer proceeds to an optimum spinning speed. The second position defines a reduced gap between an under surface of the wafer and a top surface of the wafer backside plate. The method also includes repositioning the wafer backside plate from the second position to the first position as the spinning reduces in speed. The first position defines an enlarged gap to enable loading and unloading of the wafer from the engaged position.

Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same

A system for cleaning a substrate includes a tank defining an inner cavity between a base and sidewalls extending therefrom. A source of acoustic energy affixed to an outer surface of one of the sidewalls. The tank is configured to decouple a direction associated with the acoustic energy from the source of acoustic energy and direct the acoustic energy toward the substrate.

Method and apparatus for megasonic cleaning with reflected acoustic waves

A fluid delivery module for use in preparing a substrate is provided. The fluid delivery module includes a process bowl designed to contain a substrate to be prepared. The process bowl has a bottom wall and a sidewall. The fluid delivery module further includes a fluid delivery ring configured to be attached to the sidewall of the process bowl. The fluid delivery ring includes a plurality of inlet and outlet pairs. Each of the plurality of inlet and outlet pairs is defined in the fluid ring and is designed to receive a respective supply tube. Each respective supply tube has an end that terminates at each of the outlets of the fluid delivery ring and is configured to direct fluid onto a surface of the substrate.

Methods for making and implementing fluid delivery ring

A method for processing a wafer in a spin, rinse, and dry (SRD) module is provided. The method includes engaging a wafer in a process plane, spinning the wafer in the process plane, and cleaning a top surface and a bottom surface of the wafer while spinning the wafer in the process plane. The process plane is configured to define a process angle with a horizontal plane. The process angle is configured to optimize the performance of the SRD module.

Angular spin, rinse, and dry module and methods for making and implementing the same

A megasonic module for substrate processing is provided. Embodiments of the present invention include a tank configured to hold processing fluids in which the substrate is submerged, and a lid configured to mate with and seal the tank. At least two megasonic transducers are positioned within the megasonic module to direct megasonic energy to each of an active surface and a backside surface of the substrate. A pair of drive wheels are configured to receive an edge of the substrate to support and rotate the substrate in a horizontal orientation between the at least two megasonic transducers. The substrate is supported against the pair of drive wheels by a substrate stabilizing arm/wheel which also allows the rotation of the substrate. A drive motor is configured to rotate the pair of drive wheels, and a fluid recirculation system provides for temperature control and use of a plurality of processing fluids.

Megasonic substrate processing module

An apparatus for spin drying a semiconductor wafer includes a hollow core spindle and a chuck assembly having grippers for supporting a wafer at an edge thereof. A sleeve is disposed in the central opening of the spindle and a manifold is disposed in the upper end of the sleeve. A capacitance sensor is affixed to the manifold. In another apparatus, an arm having a capacitance sensor mounted thereon is positioned such that the capacitance sensor is disposed above a space to be occupied by a wafer that is supported by the grippers. An additional apparatus includes an arm having a light source and a detector mounted thereon. The light source directs light toward a surface of a wafer such that light that reflects off of the surface is substantially perpendicular to that surface. The detector is positioned to measure the intensity of the reflected light.

Apparatus for monitoring a semiconductor wafer during a spin drying operation

An apparatus for preparing a wafer is provided. The apparatus includes a wafer backside plate and a central shaft. The wafer backside plate has a top surface that includes a cylindrical edge lip, which defines a central aperture. The central shaft is designed to fit within the central aperture. The wafer backside plate is designed to automatically slide between an up position during rotational wager processing and a down position when the wafer is not in rotational wafer processing. A gap defined between the top surface of the wafer backside plate and the wafer is less when the wafer backside plate is in the up position than when the wafer backside plate is in the down position.

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Pleasanton, CA, United States of America

Randolph E Treur