Minnesota Mining and Manufacturing Company

3m Innovative Properties Company

Trepton Research Group, Inc.

Extreme Devices Incorporated

Altera Corporation

Randolph D Schueller

Kent Kalar

Keith D Jamison

John D Geissinger

Donald E Patterson

Anthony R Plepys

Anthony A Kloba

Susan Hong, Legal Representative

Howard Edwin Evans

Donald Kent Larson

David C Koskenmaki

Duane T Smith

Robert P McCollam

David J Windschitl

Charlie Hong

David F Hebert

David A Delguzzi

A field emission device having emitter tips and a support layer for a gate electrode is provided. Openings in the support layer and the gate layer are sized to provide mechanical support for the gate electrode. Cavities may be formed and mechanically supported by walls between cavities or columns within a cavity. Dielectric layers having openings of different sizes between the emission tips and the gate electrode can decrease leakage current between emitter tips and the gate layer. The emitter tips may comprise a carbon-based material. The device can be formed using processing operations similar to those used in conventional semiconductor device manufacturing.

Gated electron emitter having supported gate

A cap can comprise an aperture, and an attenuator may block the aperture during at least one point in time. In one embodiment, the attenuator can include a cover that may be displaced by a spring. In another embodiment, such as an electron gun, may comprise a support cap with an aperture, a displaceable cover that may cover the aperture, and a spring. A material attached to the spring and acting as a fuse may release the spring and expose the aperture after an electrical current blows the 'fuse'. In yet another embodiment, a method for using a tube may comprise evacuating the tube while a cover covers an aperture in the support cap of a electron gun that is at least partially in the tube and moving the cover to expose the aperture after the tube is sealed.

Apparatus with a cap and cover assembly, an electron gun with a cap assembly, and a method of using a tube

Apparatus and method are provided for a package structure that enables mounting of a field-emitting cathode into an electron gun. A non-conducting substrate has the cathode attached and the cathode is electrically connected to a pin through the substrate. Other pins are electrically connected to electrodes integral with the cathode. Three cathodes may be mounted on a die flag region to form an electron gun suitable for color CRTs. Accurate alignment of an emitter array to the apertures in the electron gun and other electrodes such as a focusing lens is achieved. The single package design may be used for many gun sizes. Assembly and attachment of the emitter array to the electron gun during construction of the gun can lower cost of construction.

Package structure for mounting a field emitting device in an electron gun

A field emitter ( ) having improved electron emission properties is provided. Electron-emitting microtip protrusions ( ) in an emitter layer ( ) are separated from a dielectric layer ( ) by an interlayer ( ) that prevents substantial mixing of the dielectric ( ) and the emitter layer ( ) during growth of the dielectric layer ( ). A conductive gate electrode layer ( ) is deposited on the dielectric layer ( ). For carbon-based emitters, aluminum is one of several suitable interlayers between the carbon layer and a silicon dioxide dielectric layer.

Gated electron field emitter having an interlayer

A printed circuit assembly includes an interposer circuit having a flexible dielectric core with an array of contact members attached thereto. Each contact member includes a first interconnect surface accessible from a first side of the dielectric core and a second interconnect surface accessible from a second side of the dielectric core. A conductive element is attached to the first interconnect surface of each contact member. A flip chip semiconductor die includes an array of bond pads on a mounting surface thereof. Each bonding pad of the semiconductor die is substantially aligned with a respective one of the first interconnect surfaces of the interposer circuit. Each bonding pad is electrically connected to the corresponding conductive element. The electronic device defines a perimeter edge that circumscribes the array of bonding pads and the array of contact members of the interposer circuit. A solder ball is attached to the second interconnect surface of each contact member. A printed circuit substrate includes an array of solder ball pads on a surface thereof. Each one of the solder ball pads is substantially aligned with a respective one of the second interconnect surfaces. Each one of the solder ball pads is electrically connected to the corresponding solder ball.

Multi-metal layer circuit

A flexible circuit system includes a flexible dielectric layer having a first conductive layer on a first side and a second conductive layer on a second side. A non-conductive, closed end passage extends through the dielectric layer from the first side to the second side. The first conductive layer is adjacent an open end of the passage at the first side, and the second conductive layer forms the closed end of the passage at the second side. A stiffener member is attached to the second conductive layer. A solder ball is connected to provide a conductive path between the first conductive layer and the second conductive layer.

Tape ball grid array with interconnected ground plane

Apparatus and method for mounting a field emission device having emitters and an extraction grid in an electron gun are provided. The apparatus may be adapted from parts of a conventional electron gun that uses a thermionic emitter. Electrical connection to the grid is provided by bumps that are spring-loaded against a conducting surface, such as the second grid of a conventional electron gun.

Mounting for cathode in an electron gun

The present invention relates to a method for making an array of metal balls. The method includes the step of generating a first pattern on a metal foil which includes a plurality of foil projections. The method also includes the step of generating a second pattern on a carrier substrate. The second pattern includes a plurality of carrier recesses that are arranged and configured to correspond with the foil projections of the first pattern. The method further includes the steps of placing the metal foil and the carrier substrate together such that the foil projections of the metal foil fit within the carrier recesses of the carrier substrate, and melting the metal foil such that the foil projections form metal balls positioned within the carrier recesses of the carrier substrate. The invention also relates to metal ball arrays constructed via the above method.

Patterned array of metal balls and methods of making

A chip scale ball grid array for integrated circuit packaging having a nonpolymer layer or support structure positioned between a semiconductor die and a substrate. The nonpolymer support structure acts to increase circuit reliability by reducing thermal stress effects and/or by reducing or eliminating formation of voids in an integrated circuit package. A nonpolymer support structure may be a material, such as copper foil, having sufficient rigidity to allow processing of chip scale package in strip format.

Chip scale ball grid array for integrated circuit package

Chip scale ball grid array for integrated circuit packaging

A ball grid array (BGA) package is provided in which the stiffener of the BGA may also be utilized as a conductive layer. A TAB tape is adhered to the stiffener by an adhesive and both the TAB tape and the adhesive may have vias which open to the stiffener. Conductive plugs which may be formed of solder paste, conductive adhesives, or the like may then be filled in the vias to provide electrical connection from the TAB tape to the stiffener. The vias may be located adjacent to solder ball locations. The TAB tape may include multiple conductor layers or multiple layers of single conductive layer TAB tape may be stacked upon each other to provide additional circuit routing. Further, the TAB tape layers may also be combined with the use of metal foil layers.

Multi-layer interconnect sutructure for ball grid arrays

A tape ball grid array package reverses the usual attachment of flexible circuitry to a stiffener so that the circuit traces face the stiffener rather than away from the stiffener as is conventional. This construction allows the elimination of a previously necessary solder mask and so reduces the cost to produce the package.

Wire bond tape ball grid array package

A flexible circuit construction includes a polymeric sheet, via holes in the sheet and metal circuitry disposed on the sheet. The circuitry terminates at a cantilever end partially spanning the via hole to which a solder ball is subsequently attached. The cantilever end allows the solder ball to move relative to the flexible circuit and thus compensate for misalignment and-differential thermal expansion effects.

Flexible leads for tape ball grid array circuit

A flexible circuit construction allows solder balls to be mass reflow attached to the ground plane of a double-sided flexible circuit by providing a first via which is separate from the remainder of the ground plane, but which is electrically connected to the ground plane through a second via at a distance from the first via by a circuit trace on the side of the flexible circuit opposite the ground plane.

Growing community of inventors

Austin, TX, United States of America

Randolph D Schueller