Texas Instruments Corporation

Randall V Tekavec

Richard L Mahle

John Walter Orcutt

Henry L Humphrey

A method of making a ball grid array package wherein there is provided a partially fabricated package including a semiconductor die, leads and balls secured to predetermined ones of the leads. The leads and balls are concurrently coated with palladium. The die, leads and at least a portion of each of the balls are then encapsulated. Encapsulation includes providing a mold including a plurality of recesses, each recesses for receiving one of the balls. A plurality of cavities is provided in the package, each extending to one of the leads at the location of one of the balls. A plurality of mold members is provided, each extendable into one of the cavities to apply a force against the ball associated with the lead to which the cavity extends. The partially fabricated package is placed into the mold so that the balls extend into the recesses and the mold members extends into the cavities. The molding material is applied to the mold cavity to provide the encapsulation.

Lead frame type plastic ball grid array package with pre-assembled ball type contacts

A wire bond station has a platform (32) in cavity (31) of the work station heater block (30) on which a lead frame die mount pad (33) is placed during wire bonding to semiconductor chip mounted on the die mount pad. The platform (32) is of a dimension such that the edges of the die mount pad (33) extend out from the platform (32) so that irregularities (34) on the edges of the die mount pad (33) do not support the die mount pad (33) above the platform (32).

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Randall V Tekavec