Kuprion Inc.

Lockheed Martin Corporation

Randall M Stoltenberg

Alfred A Zinn

Timothy Brian Stachowiak

Andrew Thomas Fried

Jerome Chang

Copper nanoparticle paste compositions may be formulated for forming connections that are capable of operating at high temperatures by including a grain growth inhibitor with copper nanoparticles in a suitable amount. Such nanoparticle paste compositions may comprise copper nanoparticles and 0.01-15 wt. % of a grain growth inhibitor or a precursor to a grain growth inhibitor admixed with the copper nanoparticles, in which the grain growth inhibitor comprises a metal. The grain growth inhibitor is insoluble in a bulk copper matrix and is capable of residing at one or more grain boundaries in the bulk copper matrix. The one or more grain boundaries may be formed after the copper nanoparticles undergo consolidation to form bulk copper. The grain growth inhibitor may comprise various metals that are insoluble in bulk copper.

Nanoparticle paste compositions and connections formed therefrom

Metal nanoparticle agglomerates may convey biocidal activity to surfaces upon which they are deposited and become adhered, such as various air filtration media. Air filtration media may comprise a plurality of fibers having a plurality of metal nanoparticle agglomerates adhered thereto. The metal nanoparticle agglomerates may comprise a plurality of fused, partially fused, or unfused metal nanoparticles that are associated with one another upon a surface of the plurality of the fibers. Suitable metal nanoparticles for promoting biocidal activity against various pathogens, such as viruses and bacteria, may include copper nanoparticles and/or silver nanoparticles. Masks, inline filters, and air filtration systems may incorporate the air filtration media.

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Palo Alto, CA, United States of America

Randall M Stoltenberg