The Boeing Company

Hughes Electronics Corporation

Randall Jay Moss

Lynn E Long

Peter Babilo

Adam Franklin Gross

Robert W Cumberland

Christopher Stephen Roper

William B Carter

Bradley L McCarthy

Lindsay M Brisbin

Robert A Burns

Lynn Edward Long

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110&#xb0; C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than &#x2212;40&#xb0; C.

Thermally conductive flexible adhesive for aerospace applications

Adhesive compositions that contain thermally conductive carbon-based materials that are also electrically insulated; methods for using such adhesive compositions and methods for their preparation.

Thermally conductive adhesive compositions comprising carbon-based particles and methods for their use and preparation

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110&#xb0; C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than &#x2212;40&#xb0; C.

Adhesive compositions comprising electrically insulating-coated carbon-based particles and methods for their use and preparation

Low radio frequency loss, static dissipative adhesives are disclosed that have at most 2 percent by weight amorphous carbon dispersed in a cyanate ester resin. The adhesive has an electrical conductivity that dissipates static charge with an electrical resistivity of about 3.0&#xd7;10ohms to about 3.0&#xd7;10ohms, and low radio frequency loss with a dielectric constant of about 1.3 to about 1.7 and a loss tangent of at most 0.006 measured at 2 gigahertz.

Low radio frequency loss, static dissipative adhesives

An adhesive including an amorphous carbon dispersed in a cyanate ester resin, wherein the adhesive has static dissipative properties and low radio frequency loss properties.

The present invention is related to heat transfer materials including nano-scale boron nitride platelets having an aspect ratio ranging from about 10:1 to about 1000:1. The present invention also provides a method of removing heat from an object by directly or indirectly contacting the object with the heat transfer materials.

Boron nitride nano-platelete based materials

The present disclosure is generally directed to electrically conductive adhesives. More particularly, the disclosure is directed to electrically conductive adhesives comprising an organic polymer resin and an electrically conductive polymer. Advantageously, the electrically conductive adhesives have low RF loss, and are thus suitable for use in a space radar antenna and in other antenna applications where antenna components are in the RF field of view.

Low RF loss static dissipative adhesive

A phased array antenna radiator assembly that in one embodiment has a thermally conductive foam substrate, a plurality of metal radiating elements bonded to the foam substrate, and a radome supported adjacent the metal radiating elements. In another embodiment a phased array antenna radiator assembly is disclosed that has a thermally conductive substrate, a plurality of metal radiating elements bonded to the thermally conductive substrate, a radome supported adjacent the metal radiating elements, and an electrostatically dissipative adhesive in contact with the radiating elements for bonding the radome to the thermally conductive substrate.

Phased array antenna radiator assembly and method of forming same

A structure is formed of at least two structural elements that are bonded together with an electrically conductive organic adhesive system. The adhesive system is a mixture of an organic adhesive such as a thermosetting epoxy and a filler of electrically conductive carbon particles having a porous, sponge-like structure. In one application, the structural elements are exterior panels of a spacecraft coated with an electrically conductive paint, and in other applications the structural elements are not coated. The adhesive system permits static electrical charge to flow through otherwise insulated joints to equalize the static potential throughout the structure and eventually to dissipate the charge.

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Thousand Oaks, CA, United States of America

Randall Jay Moss