Medallion Technology, LLC

Dasu Limited Liability Company

Randall J Boudreaux

Steven E Garcia

James A Harden, Jr

David A Hofmann

A connection portion of a z-axis interconnector is assembled into contact with a plurality of aligned vias in a corresponding plurality of stacked printed circuit boards by gripping and pulling a leader portion of the interconnector connected to the connection portion, to move the interconnector into the final position with the connection portion contacting the aligned vias. The leader portion is severed from the connection portion after the interconnector is moved into the final position. A single pulling and cutting tool which accomplishes these functions preferably does so by a single pinch and cut device having opposing blades which partially penetrate into the leader portion to grip the leader portion, which fully penetrated through the leader portion to sever the leader portion, and which are moved toward and away from the plurality of stacked printed circuit boards to pull the interconnector and to reposition for severing the leader portion.

Method for pulling and cutting a z-axis electrical interconnector

Twist pin z-axis interconnectors are assembled in columns of aligned vias in stacked printed circuit boards of a circuit module in automated assembly cycles. Each assembly cycle involves singulating a single twist pin from a plurality of twist pins, inserting the twist pin into the via column, gripping a leader portion of the twist pin, pulling the gripped leader portion until a connection portion moves into contact with the vias of the column, severing the leader portion from the connection portion, extracting the severed leader portion, and automatically repeating assembly cycles until interconnectors have been assembled into a substantial majority of the via columns of the circuit module.

Automated twist pin assembling method for interconnecting stacked circuit boards in a module

Automated twist pin assembling machine for interconnecting stacked circuit boards in a module

Tool for pulling and cutting a Z-axis electrical interconnector

Twist pins having bulges are fabricated from helically coiled stranded wire. Wire is advanced from a source such as a spool to create slack wire configuration, and wire is then advanced from the slack wire configuration to a position where each bulge is formed. Each bulge is formed by gripping the wire in two spaced apart locations and rotating the wire in an anti-helical direction in a single continuous relative revolution to untwist the strands and form the bulge. The wire is thereafter advanced to the position of the next bulge or the position where the wire will be severed to release the fabricated twist pin. The severed fabricated twist pin is conveyed through a flow of gas in a delivery tube into a receptacle of a cassette where the twist pin is stored until used. The cassette is automatically moved to position an occupied receptacle to receive each newly fabricated twist pin.

High-speed, high-capacity twist pin connector fabricating machine and method

Wire from a wire source is supplied to create a predetermined amount of slack wire in a predetermined configuration and to maintain that slack wire configuration. Some of the slack wire is withdrawn from the configuration and advanced for use in forming an electrical connector. As wire is withdrawn from the slack wire configuration, additional wire is supplied to renew and maintain that configuration. A characteristic of the slack wire configuration is sensed to control the amount wire supplied. In this manner, the mass and rotational effects of unwinding wire from a spool while simultaneously advancing that wire are avoided, thereby avoiding wire slippage and allowing the constituent components of the connector, such as bulges of a twist pin connector, to be more precisely located during fabrication.

Wire feed mechanism and method used for fabricating electrical connectors

A method is provided for forming a plurality of solder joints for electrically and mechanically coupling a printed circuit board (,) and a flexible circuit (,). Solder is applied to the connection surfaces of the printed circuit board (,), and the connection surfaces of the flexible circuit (,) are tinned. The circuit board (,) and flexible circuit (,) are then positioned so that the connections surfaces of each are in alignment and a gap exists between circuit board (,) and flexible circuit (,). The gap between circuit board (,) and flexible circuit (,) is precisely controlled and permits the solder of the printed circuit to be in contact with the connection surfaces of the flexible circuit (,). The solder is reflowed by applying heat by vapor phase condensation.

Fixed-gap solder reflow method

An assembly, and an associated method, locates selected wires positioned amongst a plurality of wires in a wiremat. An oscillating signal is applied to the selected wires; all other wires are connected to an electrical ground potential to minimize effects of capacitive coupling. A sensing probe is positioned amongst the plurality of wires of the wiremat and a constant magnitude, variable frequency annunciation signal is generated having a frequency which varies corresponding to the proximity of the sensing probe to the selected wires.

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Colorado Springs, CO, United States of America

Randall J Boudreaux