Hewlett-Packard Development Company, L.p.

Telefonaktiebolaget Lm Ericsson (Publ)

Ericsson Ab

Randall Diaz

Kent N Shum

Perry L Hayden, Sr

Allen Hirashiki

Juan Luis Cruz

Dennis G Vaillancourt

Robert J Tong

Ming Leong

A modular cable backplane assembly for high-speed interconnection of digital electrical components in Field Replaceable Units, FRUs, () mounted in an equipment rack (). A vertical stack of a plurality of parallel horizontal cable connector carrying trays () is mounted within a rigid chassis (). The trays provide electrical component connector pins on a front side and high-speed data and power cable connectors on a back side thereof. At least one enclosed vertical channel () is attached to the vertical stack of horizontal plates () for protectively routing cables to the cable connector carrying trays. Vertical spacing of the cable connector carrying trays enables cooling fans () mounted on the rigid chassis to provide unimpeded front-to-back airflow over the FRUs (). The cable backplane assembly may be removed and replaced as a unit, and may be upgraded, in situ, from copper to optical connections.

Assembly for high-speed interconnection of digital electrical components

Systems and methods for connecting a circuit board, such as a circuit board of a fan tray, with a chassis are described herein. Systems and methods for floating, aligning, centering, grounding and blind-mating a connector set are also described herein.

Systems and methods for connecting a circuit board with a chassis

A cable management system is disclosed including a frame that can be attached to an equipment rack. Cable guides can be mounted on the frame to align a plurality of cables adjacent to each other. A cable tray is positioned adjacent the cable guides. The combination of the frame, the cable guides, and the cable tray can be positioned alongside a component in the equipment rack to route the cables around an outer edge of the component.

Systems, apparatuses, and methods for managing cables with minimum bend radius

An embodiment of a modular electronic enclosure is provided as including a chassis having a first portion defining a first compartment, and a second portion defining a second compartment. First and second replaceable units are replaceably received within the first and second compartments, respectively. The modular electronic enclosure also has a fan unit that is replaceably received within a compartment defined by the first portion or the second portion. The fan unit is configured to pull in cooling air through the first portion and exhaust pressurized cooling air through the second portion. A method of cooling a modular electronic enclosure defining first and second compartments is also provided.

Growing community of inventors

Gilroy, CA, United States of America

Randall Diaz