Intel Corporation

Randall D Lowe, Jr

James Chris Matayabas, Jr

Nisha Ananthakrishnan

Arjun Krishnan

Suriyakala Ramalingam

Syadwad Jain

Hitesh Arora

A polymer thermal interface material is described that has enhanced thermal conductivity. In one example, a vinyl-terminated silicone oil is combined with a silicone chain extender, and a thermally conductive filler comprising at least 85% by weight of the material, and comprising surface wetted particles with a range of shapes and sizes. The material may be used for bonding components inside a microelectronic package, for example.

Polymer thermal interface material having enhanced thermal conductivity

Methods for covalently and indelibly anchoring a polyacrylate polymer using a UV-induced polymerization process in the presence of a photoinitiator to an oxide surface are disclosed herein. The methods and compositions prepared by the methods can be used as indelible marking materials for use on microelectronic packages and as solder and sealant barriers to prevent overspreading of liquids on the oxide surfaces of microelectronic packages. The polyacrylate polymers are covalently linked to the oxide surface by use during the printing and UV-curing process of an adhesion promoter having as a first domain an oxide-reactive silyl group, bonded via a linker to an acrylate-reactive group.

Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials

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Chandler, AZ, United States of America

Randall D Lowe, Jr