Growing community of inventors

Del Mar, CA, United States of America

Ranadeep Dutta

Average Co-Inventor Count = 2.30

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 18

Ranadeep DuttaJonghae Kim (21 patents)Ranadeep DuttaJe-Hsiung Lan (21 patents)Ranadeep DuttaMatthew Michael Nowak (2 patents)Ranadeep DuttaRichard Hammond (2 patents)Ranadeep DuttaChanghan Hobie Yun (1 patent)Ranadeep DuttaShiqun Gu (1 patent)Ranadeep DuttaFrancesco Carobolante (1 patent)Ranadeep DuttaAbdellatif Bellaouar (1 patent)Ranadeep DuttaChoh Fei Yeap (1 patent)Ranadeep DuttaMilind Shah (1 patent)Ranadeep DuttaPeriannan Chidambaram (1 patent)Ranadeep DuttaGengming Tao (1 patent)Ranadeep DuttaKai Liu (1 patent)Ranadeep DuttaSang-June Park (1 patent)Ranadeep DuttaStephen Alan Fanelli (1 patent)Ranadeep DuttaAntonino Scuderi (1 patent)Ranadeep DuttaChuan-cheng Cheng (1 patent)Ranadeep DuttaWing Sy (1 patent)Ranadeep DuttaRanadeep Dutta (32 patents)Jonghae KimJonghae Kim (232 patents)Je-Hsiung LanJe-Hsiung Lan (82 patents)Matthew Michael NowakMatthew Michael Nowak (85 patents)Richard HammondRichard Hammond (60 patents)Changhan Hobie YunChanghan Hobie Yun (128 patents)Shiqun GuShiqun Gu (125 patents)Francesco CarobolanteFrancesco Carobolante (96 patents)Abdellatif BellaouarAbdellatif Bellaouar (74 patents)Choh Fei YeapChoh Fei Yeap (73 patents)Milind ShahMilind Shah (44 patents)Periannan ChidambaramPeriannan Chidambaram (42 patents)Gengming TaoGengming Tao (41 patents)Kai LiuKai Liu (39 patents)Sang-June ParkSang-June Park (29 patents)Stephen Alan FanelliStephen Alan Fanelli (16 patents)Antonino ScuderiAntonino Scuderi (9 patents)Chuan-cheng ChengChuan-cheng Cheng (2 patents)Wing SyWing Sy (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Qualcomm Incorporated (32 from 41,783 patents)


32 patents:

1. 12512593 - Antenna module as a radio-frequency (RF) integrated circuit (IC) die with an integrated antenna substrate, and related fabrication methods

2. 12424518 - Capacitor embedded 3D resonator for broadband filter

3. 12401326 - Reducing parasitic capacitance

4. 12334903 - Substrate comprising acoustic resonators configured as at least one acoustic filter

5. 12283607 - 3D inductor design using bundle substrate vias

6. 12255381 - Antenna modules employing three-dimensional (3D) build-up on mold package to support efficient integration of radio-frequency (RF) circuitry, and related fabrication methods

7. 12046530 - Thermal bridge interposer structure

8. 11984874 - Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods

9. 11862367 - ESL-less AC resistor for high frequency applications

10. 11791226 - Device on ceramic substrate

11. 11749746 - Radio frequency front end (RFFE) hetero-integration

12. 11689181 - Package comprising stacked filters with a shared substrate cap

13. 11652064 - Integrated device with electromagnetic shield

14. 11626236 - Stacked inductor having a discrete metal-stack pattern

15. 11605620 - Three-dimensional (3D) integrated circuit with passive elements formed by hybrid bonding

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