Chongqing University

Ran Yao

Hui Li

Zeyu Duan

Wei Lai

Renkuan Liu

Bailing Zhou

Zheyan Zhu

Jinyuan Li

Siyu Chen

Zhongyuan Chen

Disclosed is a method for testing and evaluating a short-circuit withstand capability of a press-pack power component. The method includes: building a test platform; obtaining a voltage level, a pressure load, an environment temperature, and a maximum junction temperature fluctuation range of a to-be-tested component in an actual working condition; separately testing short-circuit withstand capabilities of the to-be-tested press-pack power component; monitoring, in real time, changes of a component short-circuit current, a collector-emitter voltage, and a grid-emitter voltage until the to-be-tested press-pack power component fails due to short circuit; correspondingly obtaining a relationship between a voltage and each of a short-circuit critical energy and a critical temperature, a relationship between a pressure and a short-circuit current, and a relationship between a temperature and a short-circuit current; obtaining a relationship between a short-circuit withstand capability of the to-be-tested press-pack power component and each of a voltage, a pressure, and a temperature.

Method for testing and evaluating short-circuit withstand capability of press-pack power component

Growing community of inventors

Chongqing, China

Ran Yao