Asm Assembly Automation Limited

Asm Technology Singapore Pte Ltd

Ran Shi Wang

Jiangwen Deng

Wing Hong Leung

Zhuanyun Zhang

Siu Wing Lau

Chung Yan Lau

An apparatus for inspection of a surface of a device comprises a projection module operative to project a pattern along a projection axis of the projection module onto the device. An imaging module receives an image of the pattern reflected from the device along an imaging axis of the imaging module onto an image sensor. A lens comprised in the imaging module has a first magnification in a first direction orthogonal to the imaging axis and a second magnification different from the first magnification in a second direction orthogonal to both the first direction and the imaging axis, which produces different fields of view of the image sensor and resolutions of the image in the first and second directions.

Asymmetric pattern projection apparatus

A method for inspecting a substrate having intrinsic heterogeneous patterns for the presence of cracks comprises the steps of providing an optical device and front-side lighting on a first side of the substrate and providing near-infrared lighting on a second side of the substrate opposite to the first side. The near-infrared lighting is operable to penetrate the substrate so as to be detectable by the optical device through the substrate. One or more images are obtained by illuminating the substrate with the front-side lighting and/or the near-infrared lighting from the second side. The one or more images are thereafter processed to distinguish between the heterogeneous patterns on the substrate and any cracks present on the substrate.

Method for inspecting a photovoltaic substrate

A method of aligning a die when the die is held with a circuit pattern on a first side of the die facing away from an infrared light source, wherein infrared light from the infrared light source is projected onto a second side of the die opposite to the first side such that the infrared light passes through a body of the die. From the second side of the die, an image of the infrared light reflected from the circuit pattern is detected and captured. Thereafter, an alignment of the die from the captured image of the die is determined.

Growing community of inventors

Hong Kong, China

Ran Shi Wang