Nanofoil Corporation

Ramzi Vincent

David Van Heerden

Timothy Ryan Rude

Timothy P Weihs

Omar Knio

Ronald L Spraker

Ellen Heian

Etienne Besnoin

Yuping Lin

Somasundaram Valliappan

A method for bonding an LED assembly () or other electronic package () to a substrate PCB containing a heat-sink (), which utilizes layers of reactive multilayer foil () disposed between contacts () of the electronic packageand the associated contact pads () on the supporting substrate PCB. By initiating an exothermic reaction in the reactive multilayer foil (), together with an application of pressure, sufficient heat is generated between the contacts () and the associated contact pads () to melt adjacent bonding material () to obtain good electrically and thermally conductive bonds between the contactsand contact pads () without thermally damaging the electronic package (), heat-sensitive components () associated with the electronic package (), or other the supporting substrate PCB.

Method for low temperature bonding of electronic components

Applicants have discovered that electrostatic discharge (ESD) may, in some circumstances, result in current densities sufficient to ignite unprotected reactive composite materials. They have further discovered that a reactive composite material (RCM) can be protected from ESD ignition without adversely affecting the desirable properties of the RCM by the application of conducting and/or insulating materials at appropriate locations on the RCM. Thus ESD-protected RCM structures can be designed for such sensitive applications as ignition of propellants, generation of light bursts, and structural materials for equipment that may require controlled self-destruction.

Reactive composite material structures with electrostatic discharge protection and applications thereof

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Columbia, MD, United States of America

Ramzi Vincent