Tel Epion Corporation

Tel Nexx, Inc.

Vacuum Technology Associates Inc.

Ramya Chandrasekaran

Stephen N Golovato

Thomas G Tetreault

Georgiy Seryogin

Thomas Foley

Robert A Pollara, Jr

The disclosed technology includes a water cooled planetary system comprising a planetary gearing system and a cooling assembly integrated into the planetary gearing system. The cooling assembly further comprises a stationary shaft, a main rotary union housed within the stationary shaft and a coolant tubing disposed on the main rotary union configured to deliver a coolant.

Water cooled planetary system

Techniques disclosed herein a method and system for conditioning a polymeric layer on a substrate to enable adhesion of a metal layer to the polymeric layer. Techniques may include conditioning the polymeric layer with nitrogen-containing plasma to generate a nitride layer on the surface of the polymeric layer. In another embodiment, the conditioning may include depositing a CuN layer using a lower power copper sputtering process in a nitrogen rich environment. Following the condition process, a higher power copper deposition or sputtering process may be used to deposit copper onto the polymeric layer with good adhesion properties.

Method for increasing adhesion of copper to polymeric surfaces

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Acton, MA, United States of America

Ramya Chandrasekaran