Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Friedrich-schiller-universitat Jena

Friedrich-schiller-universtaet Jena

Ramona Eberhardt

Jens Limpert

Gerhard Kalkowski

Thomas Peschel

Andreas Tuennermann

Andreas Tünnermann

Stefan Risse

Stefan Nolte

Jan Hauptmann

Simone Fabian

Andreas Wetzig

Patrick Herwig

Achim Mahrle

Carolin Rothhardt

Paul Boettner

Mathias Rohde

Charlotte Jahnke

Mark Schuermann

Andreas Tunnermann

Steffen Böhme

Steffen Boehme

A device and a method for beam shaping and beam movement during laser material processing with a laser beam source () for continuously emitting a laser beam (), a first optical deflection element (), a second optical deflection element (), and an optical focusing element () arranged between the second optical deflection element () and a workpiece surface () to be processed. The second optical deflection element () is configured to displace a point of incidence of the laser beam () on the workpiece surface (), and the first optical deflection element () is configured to alter a position of a focal plane of the laser beam () relative to the workpiece surface () by means of a translational movement and/or to change an intensity distribution within a beam cross section of the laser beam.

Device and method for beam shaping and beam modulation during laser material processing

The invention relates to a method of joining substrates. It is the object of the invention in this respect to join substrates of substrate materials together without having to exert an increased effort for a coating with additional coating processes to be carried out and to be able to achieve a good quality of the join connection in so doing. In the method in accordance with the invention a pretreatment of at least one join surface of a substrate to be joined is carried out in low pressure oxygen plasma prior to the actual joining. On the joining, a contact force acts on the substrates to be joined in the range 2 kPa to 5 MPa and in this process a heat treatment is carried out at an elevated temperature of at least 100&#xb0; C. and at under pressure conditions of a maximum of 10 mbar, preferably &#x3c;10mbar.

Method for joining substrates

The invention relates to a method of producing lightweight structural elements which are produced as a composition construction element having at least one cover plate and one carrier element which are connected to one another. A carrier element, at which at least one apertures and/or at least one cut-out is/are formed and at least one further element, which is a cover plate, are connected to one another. A carrier element and at least one cover plate can be formed from a glass, a glass ceramic material, a ceramic material and/or silicon having an oxide surface layer which is formed at least in the bonding region of the elements to be connected to one another. The carrier element should have at least a double thickness with respect to the thickness of a cover plate. The surfaces of the cover plate(s) and of the carrier element to be connected to one another should be intensely cleaned in their bonding regions and should be smoothed such that a roughness of the surface is achieved there, such that they are in direct touching contact with at least 80% of their bonding surface with an active compression source and in this respect a thermal treatment is carried out at a temperature of at least 100&#xb0; C. and maintaining of the temperature over a period of at least 0.5 h to establish a bond connection of the cover plate(s) and the carrier element. In this respect, at least one cover plate should be connected to a surface of the carrier element at which at least one opening of an aperture or of a cut-out is arranged.

Method of producing lightweight structural elements

The present invention pertains to a process for the silicate bonding of joined surfaces, facing one another, of two components by means of an aqueous, alkaline, silicon-cation-containing joining solution for the purpose of producing an optical element, characterized in that one or both of said joined surfaces () are covered with a layer of an oxide (), which has a higher refractive index than SiOand is selected from among oxides of the third and fourth main group elements, of the second and third group of the transition elements as well as zirconium and from among mixed oxides of the said elements, whereupon the joining solution is applied to at least one of the surfaces to be joined and the surfaces are bonded to one another. The present invention also teaches the use of oxide layer () as a topmost layer of a component to be joined by means of an alkaline, silicate-containing solution for preventing or reducing opacifications and/or defects as a result of a chemical attack on the layer lying under it by the said alkaline solution.

Method for the siliceous bonding of coated and uncoated optical bodies

The present invention relates to a method for laser-assisted bonding of substrates, in which these are connected together firstly frictionally by pressing together and subsequently strengthening of the connection between the substrates is effected by activation in regions which is induced by laser irradiation. The invention likewise relates to substrates produced accordingly.

Method for laser-assisted bonding, substrates bonded in this manner and use thereof

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Bucha, Germany

Ramona Eberhardt