Stmicroelectronics Gmbh

Rammil Seguido

Jefferson Sismundo Talledo

Rennier Rodriguez

Ela Mia Cadag

Aiza Marie Agudon

Moonlord Manalo

Michael Tabiera

Raymond Albert Narvadez

Frederick Ray Gomez

Emmanuel Angeles

A semiconductor device includes a substrate that includes an opening extending through a thickness of the substrate, a frame that includes an integrated circuit (IC) die pad in the opening and a plurality of arms extending outwardly from the IC die pad, an IC mounted on the IC die pad, a plurality of bonding elements electrically coupling the substrate with the IC without the frame being an intermediary coupling element, and an encapsulant surrounding the IC, the plurality of bonding elements, and the plurality of arms. The substrate has a first major surface and a second major surface. Each arm is devoid of a contact pad. Each arm has a distal end coupled to the first major surface of the substrate, and each arm has a proximal end disposed over the first major surface of the substrate.

Semiconductor device with frame having arms

The present disclosure is directed to a semiconductor die with multiple contact pads electrically coupled to a single lead via a single wire, and methods for fabricating the same. In one or more embodiments, multiple contact pads are electrically coupled to each other by a plurality of conductive layers stacked on top of each other. The uppermost conductive layer is then electrically coupled to a single lead via a single wire.

Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame

The present disclosure is directed to a leadframe having a recess in a body of the leadframe to collect glue overflowing from the manufacturing process of coupling a semiconductor die to the leadframe. The recess extends beneath an edge of the semiconductor die so that any tendency of the glue to adhere to the semiconductor die is counteracted by a tendency of the glue to adhere to a wall of the recess and at least partially fill the volume of the recess. In addition, the recess for collecting adhesive may also form a mold lock on an edge of the leadframe, the mold lock providing a more durable connection between the leadframe and an encapsulant during physical and temperature stresses.

Modified leadframe design with adhesive overflow recesses

A semiconductor device may include a circuit board having an opening, and a frame. The frame may have an IC die pad in the opening, and arms extending outwardly from the IC die pad and coupled to the circuit board. The semiconductor device may include an IC mounted on the IC die pad, bond wires coupling the circuit board with the IC, and encapsulation material surrounding the IC, the bond wires, and the arms.

Semiconductor device with frame having arms and related methods

Delamination of stacked integrated circuit die configurations on printed circuit boards is avoided by providing a metal trace support structure underneath the die stack. The metal trace support structure features substantially equally spaced thin metal traces in place of a contiguous metal plate which has been used in the past. Spaced apart thin metal traces are less vulnerable to thermal expansion than a metal plate which has a large thermal mass. The metal traces still provide structural stability, while preventing delamination of the die stack configuration during thermal processing. A method of attaching a bridge die stack configuration to a printed circuit board by adhering a die attach film to a field of metal traces is demonstrated. In addition, the electrical and structural integrity of the bridge die stack formed with a metal trace support structure is confirmed with test results.

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Malolos, Philippines

Rammil Seguido