Polyset Company, Inc.

Rensselaer Polytechnic Institute

Motorola Corporation

Ramkrishna Ghoshal

Toh-Ming Lu

Shyam P Murarka

Pei-I Wang

James V Crivello

Prosanto K Mukerji

Structures employing siloxane epoxy polymers as diffusion barriers adjacent conductive metal layers are disclosed. The siloxane epoxy polymers exhibit excellent adhesion to conductive metals, such as copper, and provide an increase in the electromigration lifetime of metal lines. In addition, the siloxane epoxy polymers have dielectric constants less then 3, and thus, provide improved performance over conventional diffusion barriers.

Siloxane epoxy polymers as metal diffusion barriers to reduce electromigration

Solventless siloxane epoxy-based coating compositions for use on metals, plastics, wood, and glass are disclosed. The compositions are cationically curable in air by U.V. or by electron beam radiation. The siloxane epoxy coating compositions exhibit excellent film properties after curing, such as good adhesion, flexibility, and appearance. The coating compositions may be clear or may contain fillers, dyes, and pigments. A method for manufacturing a coated metal, plastic, wood, or glass substrate using the compositions is also disclosed, as well as the coated material manufactured by the method.

Solventless, non-polluting radiation curable coatings

Semiconductor devices employing siloxane epoxy polymers as low-&#x3ba; dielectric films are disclosed. The devices include a semiconductor substrate, one or more metal layers or structures and one or more dielectric films, wherein at least one dielectric film in the devices is a siloxane epoxy polymer. Use of siloxane epoxy polymers is advantageous, in part, because the polymers adhere well to metals and have dielectric constants as low as 1.8. Thus, the disclosed semiconductor devices offer much better performance than devices fabricated using conventional dielectric materials. Furthermore, the siloxane epoxy polymer dielectrics are fully curable at low temperatures, exhibit low leakage currents, and remain stable at temperatures greater than 400&#xb0; C. making them particularly attractive for use in the semiconductor industry

Siloxane epoxy polymers for low-k dielectric applications

Solventless siloxane epoxy-based coating compositions for use on metals, plastics, wood, and glass are disclosed. The compositions are cationically curable in air by heat or by electron beam radiation. The siloxane epoxy coating compositions exhibit excellent film properties after curing, such as good adhesion, flexibility, weatherability, and corrosion resistance even in the absence of a chromium-containing filler. The coating compositions may be clear or may contain fillers and/or pigments. A method for manufacturing a coated metal, plastic, wood, or glass substrate using the compositions is also disclosed, as well as the coated material manufactured by the method.

Solventless, non-polluting radiation and thermal curable coatings

A composition useful as a die-attach adhesive, polymer bump or encapsulant comprises from about 5-100% by weight of a base resin and from zero to 95% by weight of a particulate filler such as silver, wherein the base resin contains (a) from 10-95 parts by weight of a cycloaliphatic epoxy-functional siloxane, (b) from about 5-90 parts by weight of a non-silicon-containing polyepoxy resin, .COPYRGT. from about 0.1-3 parts by weight of an iodonium salt, (d) from zero to about 3 parts by weight of a copper compound and, optionally, a silane adhesion promotor and/or an elastomeric toughener.

Epoxy resin composition with cycloaliphatic epoxy-functional siloxane

Compositions for photocurable coatings are disclosed. The compositions comprise (a) an epoxidized vegetable oil, (b) a low molecular weight epoxy resin, (c) a photoinitiator for cationic polymerization and (d) a wax. Processes for making and using the coatings are also disclosed as are containers coated according to the invention.

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Clifton Park, NY, United States of America

Ramkrishna Ghoshal