Applied Materials, Inc.

Ramesh Chidambaram

Guan Huei See

Arvind Sundarrajan

Upendra V Ummethala

Michael C Kutney

Glen T Mori

Prayudi Lianto

Gaurav Mehta

Amulya Ligorio Athayde

Pin Gian Gan

Ricardo Fujii Vinluan

Wei Hao Kew

Sik Hin Chi

Muhammad Adli Danish Bin Abdullah

Shih-Chao Hung

Mark McTaggart Wylie

The present disclosure relates to methods and apparatus for forming thin-form-factor reconstituted substrates and semiconductor device packages for radio frequency applications. The substrate and package structures described herein may be utilized in high-density 2D and 3D integrated devices for 4G, 5G, 6G, and other wireless network systems. In one embodiment, a silicon substrate is structured by laser ablation to include cavities for placement of semiconductor dies and vias for deposition of conductive interconnections. Additionally, one or more cavities are structured to be filled or occupied with a flowable dielectric material. Integration of one or more radio frequency components adjacent the dielectric-filled cavities enables improved performance of the radio frequency elements with reduced signal loss caused by the silicon substrate.

Reconstituted substrate for radio frequency applications

Methods and apparatus perform backside via reveal processes using a centralized control framework for multiple process tools. In some embodiments, a method for performing a backside via reveal process may include receiving process tool operational parameters from process tools involved in the backside via reveal process by a central controller, receiving sensor metrology data from at least one or more of the process tools involved in the backside via reveal process, and altering the backside reveal process based, at least in part, on the process tool operational parameters and the sensor metrology data by adjusting two or more of the process tools involved in the backside via reveal process. The profile parameters are configured to prevent backside via breakage during a chemical mechanical polishing (CMP) process.

Methods and apparatus for backside via reveal processing

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Santa Clara, CA, United States of America

Ramesh Chidambaram