Intel Corporation

Ramaswamy Parthasarathy

Khang Choong Yong

Arvind Sundaram

Vikas Mishra

Stephen H Hall

Chin Lee Kuan

Raymond Chong

Maynard C Falconer

Jayprakash Thakur

Satish Prathaban

Vishram Shriram Pandit

Ajay Sharma

Satish Ramachandra

Bok Eng Cheah

Jackson Chung Peng Kong

Manish Sharma

Devon Worrell

Ranjul Balakrishnan

Bala P Subramanya

Vikas Rao

Punit Rathod

Yagnesh Vinodrai Waghela

Nikita Ambasana

Ajay Kumar Vaidhyanathan

Sudarshan D Solanki

Praveen Pai

Neel Harkishin Bhatia

Rajiv Panigrahi

Vaibhavdeep Singh

Ravichandra Tungani Chikkabasavaiah

A wave launcher may include a printed circuit board (PCB) that includes a pin that receives a radio frequency (RF) signal. The wave launcher may include a cylinder configured to be electrically coupled to the pin and define an opening. The cylinder may receive the RF signal from the pin, form a transition from coplanar to Goubau line structure with a plate, and generate the surface wave. The wave launcher may include an insulator configured to be physically positioned within the opening and between the cylinder and a power line. The insulator may mechanically isolate the cylinder from the power line and permit the cylinder to launch the surface wave on the power line. The wave launcher may include the plate electrically coupled to a pad and may provide a reference for the pin and the cylinder. The pin and the cylinder may be physically positioned proximate the plate.

Surface wave launcher for high-speed data links over high-voltage power lines with loss compensation structure

A communication system communicates data elements on a conducting wire. In an embodiment, a sequence of data elements to be transmitted is electrically represented on a pair of terminals, and a transmission element located at a first portion of the conducting wire transmits the sequence in the form of a wave on a surface of the conducting wire. The transmission element includes a first conductor wrapped around the first portion of the conducting wire, a first insulator located between the first conductor and the first portion of the conducting wire, and a conductive structure disposed around the first conductor. The conductive structure has a narrow cross section at one end and extends outwardly to a broader cross section at the other end. A first terminal of the pair of terminals is electrically connected to the first conductor and the second terminal is electrically connected to the conductive structure.

Transmission of data over conducting wires

Embodiments include a method of stress testing an electronics package with components that include a visual indicator. In an embodiment, the method comprises populating a plurality of components on an electronics package. In an embodiment, the plurality of components each comprise a visual indicator that is responsive to heat. In an embodiment, the method further comprises stress testing the electronics package and categorizing the plurality of components based on the visual indicators. In an embodiment, the method may further comprise modifying the plurality of components.

Capacitor with visual indicator

An apparatus is provided which comprises: a crystal having an input and an output; a first interconnect line having first and second ends, wherein the first end is coupled to the input; a second interconnect line having first and second ends, wherein the first end is coupled to the output; a first capacitor coupled to the input and ground; and a second capacitor coupled to the second end of the second interconnect line. An apparatus is provided which comprises: a high pass filter; a pair of AC coupling capacitors coupled to the high pass filter; a low pass filter coupled to the pair of AC coupling capacitors; and an analog to digital converter (ADC) coupled to the low pass filter.

Crystal oscillator interconnect architecture with noise immunity

Embodiments are generally directed to 3D high-inductive ground plane for crosstalk reduction. An embodiment of a printed circuit board includes a first signal trace and a second signal trace on a first layer, wherein the first signal trace and second signal trace are non-intersecting; a second layer below the first layer; a third layer below the second layer; and a three-dimensional (3D) ground plane, the 3D ground plane including a first plurality of segments on the third layer, a second plurality of segments on the second layer, and a plurality of metal vias to connect the first plurality of segments and the second plurality of segments in the ground plane.

3D high-inductive ground plane for crosstalk reduction

Embodiments of the present disclosure provide an arrangement for single wire communications (SWC) for an electronic device. In one instance, the arrangement may comprise a cable assembly to connect with the electronic device, wherein the cable assembly may include a wire to conduct SWC and a cover portion to cover a portion of the wire. The cover portion may comprise a ferro-dielectric material. The arrangement may further include a control logic coupled with the cable assembly, to adjust characteristics associated with the ferro-dielectric material, to tune a signal termination impedance value associated with the cable assembly. Other embodiments may be described and/or claimed.

Single wire communication arrangement

Embodiments of the present disclosure provide techniques and configurations for a cable assembly for single wire communications (SWC). In one instance, the cable assembly may comprise a wire having a wire end to couple with a signal launcher of an electronic device, and a first cover portion to house a first portion of the wire that extends from the wire end. The first cover portion may comprise a shape to conform to a shape of the signal launcher, and may be fabricated of a material with a dielectric constant above a threshold. The assembly may further comprise a second cover portion coupled with the first cover portion to house a second portion of the wire that extends from the first wire portion and protrudes from the first cover portion. The second cover portion may be fabricated of a ferrite material. Other embodiments may be described and/or claimed.

Cable assembly comprising a single wire coupled to a signal launcher and housed in a first cover portion and in a second ferrite cover portion

A solution to the technical problem of improving device-to-device connection speeds includes the use of single-wire communication (SWC). Unlike the two differential wires required in transmission lines, SWC includes a transmission method using a single wire for data without requiring a return wire. The use of SWC has the potential to enable low loss channels of increasingly high bandwidth. The SWC improvements in bandwidth and frequency enable a significant reduction of power required for communication. SWC provides significant improvement in speed for each channel, so fewer wires may be used for each device-to-device connection. SWC also provides the ability to convey increased bandwidth and increased power over each wire, which further reduces the number of wires needed to provide power and communication.

Single wire communication board-to-board interconnect

Adaptive filtering is described for use with amplifiers for any wired speaker. In one example, an apparatus includes an audio cable to provide an analog audio signal to an audio transducer, such as a speaker, the audio cable also receiving a modulated noise current, an output amplifier to receive an audio input, to generate an audio output by amplifying the audio input, and to provide the audio input to the audio cable, and a feedback system to receive the audio output and to receive a reference signal and to generate a noise cancellation signal to the output amplifier, the noise cancellation signal to cancel the modulated noise current.

Adaptive filtering for wired speaker amplifiers

An apparatus and method is described herein for reducing noise in a power distribution network for an interface. The power distribution network is characterized. And based on that characterization, worst case patterns for the interface are predicted and avoided. As one example, characterization includes providing a stimulus, such as a step function stimulus, and determining a mathematical function response, such as a step function response. Then, based on the step function response, a resonant frequency for the power distribution network is determined; from which patterns that cause the resonant frequency are identified/predicted. And when identified patterns are detected, they are scrambled or manipulated to avoid causing a worst-case noise scenario in an interface's power distribution network.

Apparatus, method, and system for predicitve power delivery noise reduction

Apparatus, method, and system for predictive power delivery noise reduction

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Bengaluru, India

Ramaswamy Parthasarathy