Xilinx, Inc.

Ramakrishna Kishore Tanikella

Steven P Young

Trevor J Bauer

Brian C Gaide

Praful Jain

Sundeep Ram Gopal Agarwal

Michael J Hart

Arifur Rahman

James Karp

Dinesh D Gaitonde

Henri Fraisse

Santosh Kumar Sood

Aashish Tripathi

Sachin K Bhutada

Configurable termination circuits for use with programmable logic devices are disclosed. In one implementation, the termination circuit may include one or more components to couple unused inputs of one or more configurable logic blocks to a fixed voltage. In another implementation, the termination circuit may include one or more components to couple unused inputs of one or more configurable logic blocks to an output of the one or more configurable logic blocks. In some implementations, the programmable logic device may include a platform management controller to configure the termination circuits based on configuration data.

Programmable termination circuits for programmable devices

A circuit for transmitting signals in an integrated circuit device is described. The circuit comprises a first die; a second die stacked on the first die; and a buffer transmitting data between the first die and the second die; wherein a first inverter of the buffer is on the first die, and a second inverter of the buffer is on the second die. A method of transmitting signals in an integrated circuit device is also described.

Circuit for and method of transmitting a signal in an integrated circuit device

A netlist of a circuit design includes an interface portion and a main portion. The interface portion is decomposed into multiple levels. Each level specifies connections between a respective first set of circuit elements and a respective second set of circuit elements. The second set of circuit elements in each level, except a last level, includes the first set of circuit elements in a next level. The first set of circuit elements identified in a first level of the multiple levels have fixed locations. The second set of circuit elements in the multiple levels is placed-and-routed. The placing-and-routing of the second set of circuit elements in one level is completed before commencing placing-and-routing of the second set of circuit elements in the next level. The main portion is placed-and-routed after placing-and-routing the second set of circuit elements in the multiple levels.

Placing and routing an interface portion and a main portion of a circuit design

A circuit block within an integrated circuit includes a multiplexor (225, 625) configured to pass either a first signal or a second signal, wherein the first signal is independent of the second signal. The circuit block further includes a first flip-flop (210, 610) configured to receive an output of the multiplexor and a second flip-flop (215, 615) configured to receive the second signal. In a first mode of operation, the multiplexor passes the first signal to the first flip-flop. Further, the first flip flop and the second flip-flop operate independently of one another. In a second mode of operation, the multiplexor passes the second signal to the first flip-flop. Further, the first flip-flop and the second flip-flop both receive the second signal.

Single event upset enhanced architecture

A circuit includes a complimentary metal-oxide semiconductor (CMOS) storage element implemented within a p-type substrate and an n-well implemented within the p-type substrate that is independent of the storage element. The n-well and the storage element are separated by a minimum distance in which the p-type substrate includes no n-well.

Reduction of single event upsets within a semiconductor integrated circuit

A method and apparatus to test the inter-die interface between two or more semiconductor die in die stacking applications, where a mismatch exists between the number of input and output pads on a base die and the number of input and output pads on a stacked die. In a first embodiment, a number of through-die vias (TDVs) may be used to implement inter-die signal paths using standard or flexible design rules to maintain statistical TDV yield despite the lack of continuity verification of the inter-die signals paths. In alternate embodiments, programmable multiplexers may be utilized to share one or more inter-die connections between the base die and the one or more stacked die so as to facilitate testing and normal operation of each inter-die connection. In other embodiments, spare TDVs are utilized only during test operations, so as to accommodate the mismatch. In yet other embodiments, built-in-test (BIT) circuits are configured to perform logic operations using a plurality of inter-die input/output (I/O) signals to eliminate the need to implement an identical number of input and output ports between the base die and the one or more stacked die to facilitate inter-die testing.

Method and apparatus for programmable device testing in stacked die applications

A programmable integrated circuit (IC) with mirrored interconnect structure. The IC includes a plurality of arrangements, which are horizontally arranged. Each arrangement includes a first logic column, an interconnect column, and a second logic column. Each interconnect column includes programmable interconnect blocks (), and each of the first and second logic columns includes programmable logic blocks. Each programmable interconnect block provides a plurality of first input and output ports on a first side and a plurality of second input and output ports on a second side. The first ports and the first side of each of the programmable interconnect blocks physically mirror the second ports and the second side of the programmable interconnect block. The ports of the programmable interconnect blocks are coupled to the ports of the programmable logic blocks in the first and second logic columns.

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Hyderabad Telangana, India

Ramakrishna Kishore Tanikella