Intel Corporation

Sandisk Technologies Inc.

Rama Shukla

Venkatesan Murali

Nagesh K Vodrahalli

Shrikar Bhagath

Chih Yang Li

Srinivasan Sivaram

A processing core includes a multi-core processor integrated directly onto a high bandwidth, high-capacity non-volatile memory. The processor may for example be a large graphics processing unit (GPU) or artificial intelligence (AI) processor. The non-volatile memory may comprise a CBA (CMOS bonded to array) memory tile having a single large NAND memory tile coupled together with a CMOS logic circuit tile. The integrated processor and CBA memory tile may be affixed to an interposer. The processing core may further include stacks of high bandwidth memory (HBM) semiconductor dies affixed to the interposer around one or more sides of the processor and CBA memory tile.

Processing core including integrated high capacity high bandwidth storage memory

A semiconductor device is disclosed including a memory module formed from a pair of semiconductor dies mounted face to face to each other at the wafer level, mechanically resulting in the die pair having a minimum warpage. An electronic component may be bonded to an exposed surface of one of the semiconductor dies.

Memory scaling semiconductor device

A semiconductor device is disclosed including a memory module formed from a pair of semiconductor dies mounted face to face to each other at the wafer level. These die pairs are formed using wafer-to-wafer bonding technology, where the wafers may be bonded to each other when they are of full thickness. The semiconductor device may further include a CMOS logic circuit as part of the pair of semiconductor dies or in its own semiconductor die mounted to the pair of semiconductor dies.

A lithographic process is used to place a marking on a waveguide to indicate optical channels within the waveguide. A photonic component is positioned against the waveguide based on the markings and adjusted until aligned.

Markings for aligning fiber optic bundle

A device has both electronic and photonic components on a shared substrate. The electronic components may include a light source for providing a photonic signal around the substrate to the photonic components.

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Saratoga, CA, United States of America

Rama Shukla