Analog Devices International Unlimited Company

Rama Krishna Kotlanka

Michael Delaus

Susan L Feindt

Kenneth Flanders

Matthew Duffy

Ryan Iutzi

A transfer printing method is described that can be used for a wide variety of materials, such as to allow for circuits formed of different materials to be integrated together on a single integrated circuit. A tether () is formed on dice regions () of a first wafer (), followed by attachment of a second wafer () to the tethers. The dice regions () are processed so as to be separated, followed by transfer printing of the dice regions to a third wafer ().

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Belmont, MA, United States of America

Rama Krishna Kotlanka