Average Co-Inventor Count = 3.87
ph-index = 8
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Intel Corporation (47 from 54,155 patents)
47 patents:
1. 12388019 - Pitch translation architecture for semiconductor package including embedded interconnect bridge
2. 12347783 - Interconnect architecture with silicon interposer and EMIB
3. 12283535 - IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects
4. 12261150 - Mold shelf package design and process flow for advanced package architectures
5. 12176292 - Microelectronic component having molded regions with through-mold vias
6. 12087731 - No mold shelf package design and process flow for advanced package architectures
7. 12051647 - Pitch translation architecture for semiconductor package including embedded interconnect bridge
8. 11984377 - IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects
9. 11935808 - IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects
10. 11923267 - IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects
11. 11901299 - Interconnect architecture with silicon interposer and EMIB
12. 11901333 - No mold shelf package design and process flow for advanced package architectures
13. 11817390 - Microelectronic component having molded regions with through-mold vias
14. 11705398 - Pitch translation architecture for semiconductor package including embedded interconnect bridge
15. 11640942 - Microelectronic component having molded regions with through-mold vias