Ball Semiconductor Corporation

Ram K Ramamurthi

Ivan Herman Murzin

Ramesh K Kasim

Alex Reddy Freeman

Nobou Takeda

T Ohkusa

A method for securing a device, such as a spherical shaped semiconductor integrated circuit, for fabrication. An apparatus includes a plenum having an input and several outputs. The input of the plenum is connected to a pressurized fluid source. The outputs are separated into two groups: a centralized output and several peripheral outputs. The outputs connects to apertures located on a top surface of the apparatus. The centralized apertures expel the pressurized fluid from the fluid source to suspend the spherical shaped semiconductor integrated circuit device above the top surface. The peripheral apertures expel the pressurized fluid from the fluid source to secure the device above the centralized apertures.

Touchless stabilizer for processing spherical devices

An apparatus and method for performing material deposition on semiconductor devices. The apparatus provides an enclosure for defining a chamber. The chamber includes a metallic portion such as a conductor coil powered by a voltage generator. A gas, having a suspension of particles for treating the semiconductor devices, is introduced into the chamber and the powered conductor coil converts the gas to inductively coupled plasma and vaporizes the particles. The particles can then be deposited on the semiconductor devices.

Inductively coupled plasma powder vaporization for fabricating integrated circuits

An apparatus for securing a device, such as a spherical shaped semiconductor integrated circuit, for fabrication. The apparatus includes a plenum having an input and several outputs. The input of the plenum is connected to a pressurized fluid source. The outputs are separated into two groups: a centralized output and several peripheral outputs. The outputs connects to apertures located on a top surface of the apparatus. The centralized apertures expel the pressurized fluid from the fluid source to suspend the spherical shaped semiconductor integrated circuit device above the top surface. The peripheral apertures expel the pressurized fluid from the fluid source to secure the device above the centralized apertures.

Touchless stabilizer for processing spherical shaped devices

An apparatus and a method for producing a mask, which was derived using two-dimensional design tools, for imparting circuit designs directly on a three-dimensional surface. The method for creating the mask includes the steps of creating a two dimensional design with at least one element, establishing a location coordinate for the element using a two-dimensional coordinate system, converting the location coordinate for the element into a spacial coordinate for the element using a three-dimensional spacial coordinate system, converting the spacial coordinate for the element into a positional coordinate, and generating the mask using the positional coordinate. The apparatus for implementing three-dimensional designs using a mask, which is generated from a two-dimensional design, includes a light source and an elliptical mirror. The elliptical mirror has two focal points so that the elliptical mirror can focus a beam of light onto the three-dimensional surface.

Two-dimensional to three-dimensional VLSI design

An apparatus and method for separating fluid from a device such as a spherical shaped semiconductor integrated circuit. To this end, one embodiment provides a first area for receiving the device, a reducing area registering with the first area, a first passage centered in the reducing area, and a second passage adjacent the first passage. The pressure inside the first area is greater than the pressure inside the reducing area. Also, the pressure inside the first passage is greater than the pressure inside the second passage. The device moves through the first area and into the reducing area. Once in the reducing area, the device is inclined to enter the first passage while at least part of the fluid is inclined to enter the second passage. As a result, the fluid is thereby separated from the device.

Device and fluid separator for processing spherical shaped devices

Inductively coupled plasma powder vaporization for fabricating

An apparatus and method for fabricating integrated circuits according to which a plurality of members of a semiconductor material are continuously introduced into a chamber. A process gas is introduced into the chamber in a direction extending at an angle to the direction of passage of the members into the chamber in a manner so that the gas contacts the members during its passage through the chamber to treat the members.

Apparatus for fabricating spherical shaped semiconductor integrated

An apparatus and method for connecting and interconnecting spherical ICs. The apparatus includes an enclosure which is used to hold and secure one or more spherical ICs or to connect to a device such as a printed circuit board. The enclosure includes two groups of electrical contact points. These contact points may be solder bumps, pads, leads, or any other type of connector. One group of contact points on the enclosure aligns and connects with a corresponding set of contact points on the first spherical shaped IC and the other group of contact points on the enclosure aligns and connects with a corresponding set of contact points on the other device. The two groups of enclosure contact points are interconnected with each other through a circuit located inside the enclosure. As a result, alignment is no longer required by the contact points on the spherical shaped IC and the other device.

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Allen, TX, United States of America

Ram K Ramamurthi