Heliatek Gmbh

Ralph Wichtendahl

Michael Eritt

Judith Geoerg

Michael Meissner

Andreas Borkert

Merve Anderson

An encapsulation system, including a first encapsulation formed from at least one front barrier layer on a front face of the optoelectronic component and at least one rear barrier layer on a reverse face of the optoelectronic component with at least one first connecting material disposed in between, and a second encapsulation formed from at least one front protective layer on the front face of the optoelectronic component and at least one rear protective layer on the reverse face of the optoelectronic component with at least one second connecting material disposed in between, wherein the first encapsulation surrounds the optoelectronic component such that the first encapsulation projects beyond the optoelectronic component by a first edge region, and the second encapsulation surrounds the first encapsulation comprising the optoelectronic component such that the second encapsulation projects beyond the first edge region of the first encapsulation by a second edge region.

Encapsulation system for an optoelectronic component comprising at least a first encapsulation and a second encapsulation, and optoelectronic component comprising an encapsulation system of this kind

An optoelectronic component, including: a bottom electrode, a top electrode, a layer system having at least one photoactive layer, the layer system being disposed between the bottom electrode and the top electrode, a planarization layer disposed on a side of the bottom electrode and/or top electrode facing away from the layer system, at least one barrier layer disposed on the planarization layer, and at least one busbar, the at least one busbar being disposed on the at least one barrier layer, wherein: the planarization layer has electrically conductive particles the electrically conductive particles being introduced into the planarization layer, and the electrically conductive particles electrically conductively bridge the planarization layer through the at least one barrier layer such that the bottom electrode and/or the top electrode electrically conductively contacts the at least one busbar.

Optoelectronic component and method for contacting an optoelectronic component

In a method for imprinting optoelectronic components with at least one bus bar, the bus bar following the shape of the optoelectronic component and allowing a homogeneous color impression on the rear face of the component, the bus bar is printed on a basic material before deposition of a photoactive layer. The basic material may comprise a substrate, or an electrically conductive transparent layer on a substrate. Subsequently, a conductive layer on the substrate is structured to form isolated regions, the photoactive layer is deposited and structured, and then a counter electrode is applied and structured.

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Dresden, Germany

Ralph Wichtendahl