Intel Corporation

Ralph V Miele

Andrew Larson

Jeffory L Smalley

David Shia

Phil Geng

Mark E Sprenger

Eric W Buddrius

Sandeep Ahuja

David Pidwerbecki

Dan H Gerbus

Mark Angus MacDonald

Eric Dwight McAfee

Russell S Aoki

Thomas A Boyd

Kenan Huseyin Arik

Drew G Damm

Mengqi Liu

Rolf Laido

Aleksander Magi

Paul J Gwin

Barrett M Faneuf

Jered H Wikander

Shawn McEuen

Casey R Winkel

Steven A Klein

Anthony P Valpiani

Weibo Chen

Craig J Jahne

Richard Paul Crawford

Michael S Brazel

Konstantin I Kouliachev

Kristin L Weldon

Marc Milobinski

Aaron P Anderson

Carlos Alvizo Flores

Olaotan Elenitoba-Johnson

Brendan T Pavelek

Lily Kolle

Fernando Gonzalez Lenero

Shyamjith Mohan

Minh T D Le

Duck Young Kong

Daniel Pohl

James Utz

Eduardo Escamilla

Gregory A Peek

Koba Natroshvili

Shantanu Dattatraya Kulkarni

Sriram Srinivasan

Cornelius Buerkle

Yoshifumi Nishi

Gregorio R Murtagian

Xiaoning Ye

Kuang C Liu

Jin Yang

Gustavo Fricke

Kimi Morooka Jensen

Bijoyraj Sahu

David George Payne

Mohanraj Prabhugoud

Roman Schick

Isaac A Simpson

Baomin Liu

Amin M Godil

Feroz Mohammad

Tongyan Zhai

Timothy Glen Hanna

Kerry A Stevens

Robert R Atkinson

James M Yoder

Shelby A Ferguson

Mustafa H Haswarey

Michael Hui

Patrick Chewning

Meenakshi Gupta

Evan A Chenelly

Brandon Courtney

Stephen J Allen

Venkat R Gaurav

Brian R Peil

Jimmy Chuang

Daniel Neumann

Ming-Chen Chang

Subhas Balappanavar

Divya Swamy Bandaru

Ellann Cohen

Eric D Mcafee

Eric Erike

Ricky O Branner

Kristin L Weihl

Alanna M Koser

Andreas Herden

Henning Schroeder

Shaun Gerrit Immeker

Ulises Encarnacion

Sri Priyanka Tunuguntla

Shaun G Immeker

Jacob Mcmillian

Elizabeth Stortstrom

Luis Gil Rangel

An apparatus is described. The apparatus includes a back plate. The apparatus includes a bolster plate that is secured to the back plate with a back bolt. The bolster plate has a window. The apparatus includes a circuit board between the back plate and the bolster plate. A semiconductor chip package is electro-mechanically coupled to the circuit board within the window. The apparatus includes a load stud that emanates from a face of the bolster plate. The back bolt emanates from an opposite face of the bolster plate. The load stud and back bolt are oriented along a same axis that is orthogonal to the face and the opposite face. The apparatus includes a heat sink. The apparatus includes a loading plate. The heat sink is mounted to the loading plate. The loading plate has a fixturing element that is secured to the load stud to secure the loading plate to the bolster plate.

Semiconductor chip package thermo-mechanical cooling assembly

An apparatus is described. The apparatus includes a bolster plate having a first fixturing element and a strap. The strap is positioned along a frame arm of the bolster plate. The strap has a second fixturing element to be fixed to a cooling mass. The strap is to diminish movement of the cooling mass along the frame arm's dimension and a dimension that is orthogonal to the frame arm's dimension. A semiconductor chip package is to be placed in a window opening formed by the bolster plate's frame arms. The cooling mass is to be thermally coupled to the semiconductor chip package.

Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling mass

Techniques for processor loading mechanisms are disclosed. In the illustrative embodiment, a heat sink is in contact with a top surface of a processor, applying a downward force on the processor. A load plate is also in contact with the processor, applying a downward force to the processor as well. The combination of the downward force from the load plate and the heat sink keep the processor in good physical contact with pins of the processor socket. The heat sink has enough force applied to the processor to be in good thermal contact with the processor without applying higher stress to the heat sink. The load plate can apply force to the processor without regard to the thermal characteristics of the load plate. Other embodiments are envisioned and described.

Technologies for processor loading mechanisms

An apparatus is described. The apparatus includes a semiconductor chip package loading assembly having a heat sink and a first magnetic material, the first magnetic material to be mechanically coupled to a first side of a printed circuit board that is opposite a second side of the printed circuit board where input/outputs (I/Os) of the semiconductor chip package interface with the printed circuit board. The first magnetic material to be positioned between the printed circuit board and a second magnetic material. The first magnetic material is to be magnetically attracted to the second magnetic material to impede movement of the heat sink.

Magnetically secured semiconductor chip package loading assembly

An apparatus is described. The apparatus includes a ceiling part and a floor part of a thermally conductive component to be placed upon a semiconductor chip package integrated heat spreader to remove heat from at least one semiconductor chip within the semiconductor chip package. Respective inner surfaces of the floor part and the ceiling part are to face one another with space in between such that one or more cavities exist within the thermally conductive component between the respective inner surfaces. The apparatus includes a frame component to be abutted against at least one of the ceiling part and the floor part to impede deformation of at least one of the ceiling part and the floor part when loading forces are applied to a thermal assembly that includes the thermally conductive component and the semiconductor chip package.

Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force

An apparatus is described. The apparatus includes a back plate, where, an electronic circuit board is to be placed between the back plate and a thermal cooling mass for a semiconductor chip package. The back plate includes a first material and a second material. The first material has greater stiffness than the second material. The back plate further includes at least one of: a third material having greater stiffness than the second material; re-enforcement wires composed of the first material; a plug composed of the second material that is inserted into a first cavity in the first material, a stud inserted into a second cavity in the plug. An improved bolster plate having inner support arms has also been described.

Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention

An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Electronic systems with inverted circuit board with heat sink to chassis attachment

An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.

Socket load regulation utilizing CPU carriers with shim components

Autonomous unmanned vehicles (UVs) for responding to situations are described. Embodiments include UVs that launch upon detection of a situation, operate in the area of the situation, and collect and send information about the situation. The UVs may launch from a vehicle involved in the situation, a vehicle responding to the situation, or from a fixed station. In other embodiments, the UVs also provide communications relays to the situation and may facilitate access to the situation by responders. The UVs further may act as decoupled sensors for vehicles. In still other embodiments, the collected information may be used to recreate the situation as it happened.

Autonomous unmanned vehicles for responding to situations

A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

Mechanism combining fastener captivation and assembly tilt control for microprocessor thermal solutions

A microprocessor loading mechanism, comprising a bolster plate surrounding an aperture, wherein the opening is to receive a microprocessor socket, one or more torsion bars coupled to the bolster plate, and a stud coupled to each of the one or more torsion bars, wherein each stud is to receive a nut to secure a microprocessor package to the microprocessor socket within the aperture and wherein each stud is secured to the bolster plate by each corresponding torsion bar.

Scalable, high load, low stiffness, and small footprint loading mechanism

A microprocessor heat sink fastener, comprising a nut comprising a thermoplastic material and fibrous fill particles and a bore extending along an axis of the nut. The bore has internal threads. The internal threads comprise a surface. At least one of the fibrous fill particles has first and second ends extending from the surface into a sub-surface region.

Scalable debris-free socket loading mechanism

Techniques for forming and adjusting a magnetic tension mechanism are described herein. A system includes a first magnetic element in a first component of a computing device. The system includes a second magnetic element in a second component of the computing device, wherein the first magnetic component and the second magnetic component are to be held in tension by a magnetic force. The system also includes an adjustment mechanism to adjust the force required to decouple the magnetic elements.

Adjustment of magnetic force in a computing device

A dual screen display device may include a set of displays including a first display and a second display. A base may support the displays. A hinge may be coupled between the first and second displays. A channel and post may be provided in the displays and the base to provide a sliding translation between the base and the displays. In some embodiments of the dual screen device, the hinge, channel and post cooperate to provide a coupled translation of the first and second displays relative to the base.

Convertible dual screen laptop

Growing community of inventors

Hillsboro, OR, United States of America

Ralph V Miele