Kla Tencor Corporation

Kla-tencor Technologies Corporation

Tencor Instruments

Kla Instruments Corporation

Ralph T Johnson

Jamie Michael Sullivan

Wenjian Cai

Rex Runyon

Mark Shi Wang

Keith B Wells

Kai Cao

Yevgeniy Churin

Eric Vella

Meier Yitzhak Brender

Yong Mo Moon

Evegeny Churin

David J Clark

Lee H Veneklasen

Alan D Brodie

Chung-Shih Pan

Curt H Chadwick

Brian C Leslie

John S Taylor

John D Greene

Eric Munro

Richard R Simmons

Lee K Galbraith

Chetana Bhaskar

Anil A Desai

Dan Meisburger

Dieter Wilk

Timothy L Hutcheson

John McMurtry

April Dutta

Anlun Tang

Barry Becker

Jack Y Jau

Paul Wieczorek

Dennis G Emge

Henry Pearce-Percy

Kirkwood Rough

Surendra Lele

Mingguang Li

Chun C Lin

Hoi T Nguyen

Yen-Jen Oyang

Chris Kirk

Sam Wong

Dean Walters

David E Smith

Mike Robinson

Ray Paul

Hans Dohse

Ming-Yie Ling

Hung Nguyen

John Gibson

Eric N Vella

Dieter E Wilk

A method of scanning a sample includes simultaneously forming a plurality of co-linear scans. Each scan is formed by a sweep of a spot by an acousto-optical device (AOD). The co-linear scans are separated by a predetermined spacing. A first plurality of swaths are formed by repeating the simultaneous forming of the plurality of co-linear scans in a direction perpendicular to the co-linear scans. The first plurality of swaths have an inter-swath spacing that is the same as the predetermined spacing. The predetermined spacing can be a scan length or an integral number of scan lengths. A second plurality of swaths can be formed adjacent to the first plurality of swaths. Forming the second plurality of swaths can be performed in an opposite direction to that of the first plurality of swaths or in a same direction. An inspection system can implement this method by including a diffractive optical element (DOE) path after a magnification changer.

Interleaved acousto-optical device scanning for suppression of optical crosstalk

Disclosed are apparatus and methods for inspecting or measuring a specimen. A system comprises an illumination channel for generating and deflecting a plurality of incident beams to form a plurality of spots that scan across a segmented line comprised of a plurality of scan portions of the specimen. The system also includes one or more detection channels for sensing light emanating from a specimen in response to the incident beams directed towards such specimen and collecting a detected image for each scan portion as each incident beam's spot is scanned over its scan portion. The one or more detection channels include at least one longitudinal side channel for longitudinally collecting a detected image for each scan portion as each incident beam's spot is scanned over its scan portion.

Multi-spot scanning collection optics

A method of scanning a sample includes simultaneously forming a plurality of co-linear scans. Each scan is formed by a sweep of a spot by an acousto-optical device (AOD). The co-linear scans are separated by a predetermined spacing. A first plurality of swaths are formed by repeating the simultaneous forming of the plurality of co-linear scans in a direction perpendicular to the co-linear scans. The first plurality of swaths have an inter-swath spacing that is the same as the predetermined spacing. A second plurality of swaths can be formed adjacent to the first plurality of swaths. Forming the second plurality of swaths can be performed in an opposite direction to that of the first plurality of swaths or in a same direction. An inspection system can implement this method by including a diffractive optical element (DOE) path after a magnification changer.

Systems and methods for scanning a beam of light over a specimen are provided. A system may include a pre-scan acousto-optical deflector (AOD) configured to deflect a beam of light, a second AOD configured as a traveling lens to focus the scanning beam, a relay lens, and an objective lens. The relay lens may be centered on the scan line produced by the second AOD, while the objective lens may be substantially de-centered with respect to the relay lens to produce a telecentric scanning spot with no field tilt. The system may modulate the amplitude of the sound wave in the first AOD to compensate for attenuation in the second AOD. The system may pre-fill one chirp packet in the second AOD while another chirp packet is scanning to substantially reduce a delay between consecutive scans.

Systems and methods for scanning a beam of light across a specimen

Disclosed are mechanisms for selectively filtering spatial portions of light emanating from a sample under inspection within an optical system. In one embodiment, a programmable spatial filter (PSF) is constructed from materials that are compatible with light in a portion of the UV wavelength range. In a specific implementation, the PSF is constructed from a UV compatible material, such as a polymer stabilized liquid crystal material. In a further aspect, the PSF also includes a pair of plates that are formed from a UV grade glass. The PSF may also include a relatively thin first and second ITO layer that results in a sheet resistance between about 100 and about 300 &OHgr; per square. The PSF provides selective filtering in two directions. In other words, the PSF provides two dimensional filtering.

Two-dimensional UV compatible programmable spatial filter

Light scattered from illuminated spot on a patterned wafer is first passed through a di-electric filter and then by an optical fiber bundle to a detector. The di-electric filter controls the aperture of the light that is passed to a desired azimuth angle and the optical fiber further limits the aperture.

Particle detection system employing a subsystem for collecting scattered

There is disclosed numerous embodiments of a method and apparatus for a particle scanning system and an automatic inspection system. In each of these a particle beam is directed at the surface of a substrate for scanning that substrate. Also included are a selection of detectors to detect at least one of the secondary particles, back-scattered particles and transmitted particles from the substrate. The substrate is mounted on an x-y stage to provide it with at least one degree of freedom while the substrate is being scanned by the/particle beam. The substrate is also subjected to an electric field on it's surface to accelerate the secondary particles. The system also has the capability to accurately measure the position of the substrate with respect to the charged particle beam. Additionally, there is an optical alignment means for initially aligning the substrate beneath the,particle beam means. To function most efficiently there is also a vacuum means for evacuating and repressurizing a chamber containing the substrate. The vacuum means can be used to hold one substrate at vacuum while a second one is being loaded/unloaded, evacuated or repressurized. Alternately, the vacuum means can simultaneously evacuate a plurality of substrates prior to inspection and repressurize of the same plurality of substrates following inspection. In the inspection configuration, there is also a comparison means for comparing the pattern on the substrate with a second pattern.

Electron beam inspection system and method

A method of locating particle and defect features on a periodically patterned surface uses multiple threshold intensity levels to identify features in the data stream produced by scanning the surface with a light beam and detecting the light scattered from the surface. High thresholds are assigned to regions of the surface with high background scatter, while low thresholds are assigned to regions of the surface with low background scatter. The scattered light is detected with a wide dynamic range detector producing high resolution 12-bit pixel data capable of resolving the smallest particles and defects of interest in low scatter regions, while avoiding saturation in high scatter regions. Periodic pattern features are removed from the data by mapping features from a plurality of periodically repeating die on the surface to a single die map and looking for overlapping features. Unique, nonoverlapping features are determined to correspond to particles and defects. In one embodiment, only a portion of all the die on the surface are mapped at one time to reduce the possibility of accidental overlap of particle and defect features.

Process for inspecting patterned wafers

Growing community of inventors

Los Gatos, CA, United States of America

Ralph T Johnson