At&t Bell Laboratories

Ralph T Hepplewhite

Bertram Schwartz

Gerard E Henein

Indium is used to bond semiconductor lasers to their heat-sinks without the presence of a corrosive liquid flux. Fluxless bonding is achieved in a vacuum chamber in reducing ambients of CO or H.sub.2. Low strain bonds are achieved at bonding temperatures of approximately 180.degree.-240.degree. C. in CO and 220.degree.-230.degree. C. in H.sub.2. Void-free bonds are achieved in CO at temperatures as low as about 205.degree. C. The technique is applicable to other microelectronic chips such as LEDs, for example.

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Millington, NJ, United States of America

Ralph T Hepplewhite