Seagate Technology Incorporated

Other

Rls Products

Ralph Smith

Aaron Michael Collins

Paul Davidson

Roger Lee Hipwell, Jr

Scott Eugene Olson

Kevin Jon Schulz

Joseph Michael Stephan

Michael Louis Rancour

Jon Paul Hurley

A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to and at an angle relative to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube having tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to liquefy the solder sphere until it falls from the exit orifice, waiting for a predetermined time period after the liquefied solder sphere has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.

Method of forming electrical connections with solder dispensing and reflow

A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube comprising tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to provide a level of thermal energy to liquefy the solder sphere, detecting the movement of the liquefied solder sphere after it has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.

A laser is configured to emit light along a substrate-parallel plane along a first surface of the laser. An etched facet is on an emitting end of a lasing cavity and an etched mirror is on another end of the lasing cavity. An etched shaping mirror redirects light received from the etched facet in a direction normal to the substrate-parallel plane. A slider comprises an optical input coupler configured to couple the light from the laser into a waveguide of the slider. At least one protrusion is disposed on the laser and at least one recession is disposed on the slider, the at least one protrusion and the at least one recession configured to align the laser with the slider to allow the light to be coupled into the optical input coupler.

Horizontal cavity surface emitting laser assembly features for heat assisted magnetic recording

Implementations disclosed herein provide a method comprising emitting light at a plurality of locations across a surface of a recording head, detecting light output from a diffraction grating axis with a detector, and determining a target position for mounting a light source on the surface of the recording head by analyzing the detected light output corresponding to one or more of the plurality of locations.

Light source alignment

An apparatus includes a slider, a light source disposed upon an outer surface of the slider and a projection extending above the outer surface of the slider. The light source comprises a resonant cavity aligned with the outer surface of the slider. The projection comprises an optical turning element that is optically coupled to the light source. Also included are methods of fabrication thereof.

Slider for magnetic recording apparatus with projection comprising optical turning element and methods of fabrication thereof

Implementations disclosed herein provide a method comprising emitting light at a plurality of locations across a surface of a recording head assembly, detecting, using a detector not positioned along a waveguide axis, light output from a diffraction grating positioned along the waveguide axis, and determining a target position for mounting a laser source on the surface a recording head assembly by analyzing the detected light output corresponding to one or more of the plurality of locations.

Sub-micron precision alignment between two microelectronic components can be achieved by applying energy to incite an exothermic reaction in alternating thin film reactive layers between the two microelectronic components. Such a reaction rapidly distributes localized heat to melt a solder layer and form a joint without significant shifting of components.

Attachment of microelectronic components

An electrical connection assembly includes a body, an electrically insulative layer supported by the body, a first bond pad defined on the electrically insulative layer, a first electrical contact pad defined on the electrically insulative layer and electrically isolated from the first bond pad, a circuit located adjacent to the electrically insulative layer defining a second bond pad and a second electrical contact pad that are electrically isolated from each other, and an electrically conductive bonding material that electrically and mechanically links the first and second bond pads. After setting, the electrically conductive bonding material biases the first and second electrical contact pads against each other in order to create an electrical connection therebetween.

High density electrical interconnect assembly

The invention is a suspension gimbal-head assembly that includes a magnetic head having a leading edge and a following edge, a suspension gimbal, the magnetic head is mechanically connected to the suspension gimbal at the head leading edge and the head following edge. There is also provided a disk drive that includes a suspension gimbal-head assembly that includes a magnetic head having a leading edge and a following edge, a suspension gimbal, the magnetic head mechanically connected to the suspension gimbal at the head leading edge and the head following edge.

Leading edge bond pads

An improved broadband off-center fed dipole antenna, the Smithdom antenna, capable of resonating at multiple frequencies with a near integer relationship between fundamental and harmonic frequencies and with standing wave ratio of less than or equal to 2:1 at desired frequencies without the need of an antenna tuning device. The antenna comprises a first radiating section having an inner line electrically coupled to a balun transformer and a trap and an outer line electrically connected to a trap and an insulator. A second radiating section is connected to the balun transformer and has another insulator secured to its other end.

Smithdom multiband antenna

A broadband off-center fed dipole antenna capable of resonating at multiple frequencies with a near integer relationship between fundamental and harmonic frequencies and with standing wave ratio of less than or equal to 1.5:1 at desired frequencies without the need of an antenna tuning device. One preferred embodiment of the antenna comprises a first radiating section having an inner line electrically coupled to a balun transformer and a trap and an outer line electrically connected to the trap and an insulator. A second radiating section is connected to the balun transformer and has another insulator secured to its other end.

Growing community of inventors

Eden Prairie, MN, United States of America

Ralph Smith